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Systems and methods for solder mask inspection

A solder mask, printed circuit board technology, applied in general parts of printing machinery, printing, printing devices, etc., can solve problems such as reducing production line output and increasing processing-related defects

Inactive Publication Date: 2016-12-21
CAMTEK LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The process requires many panel handlings with various systems (e.g., AOI, cleaning equipment, solder mask deposition equipment, etc.), significantly increasing handling-related defects that reduce production line throughput

Method used

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  • Systems and methods for solder mask inspection
  • Systems and methods for solder mask inspection
  • Systems and methods for solder mask inspection

Examples

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Embodiment Construction

[0011] It will be appreciated that for simplicity and clarity of explanation, elements shown in the figures have not necessarily been drawn to scale. For example, the dimensions of some of the elements may be exaggerated relative to other elements for clarity. Further, where considered appropriate, reference numerals may be repeated among the figures to indicate corresponding or analogous elements.

[0012] In the following detailed description, numerous specific details are given in order to provide a thorough understanding of the present invention. However, it will be understood by those skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known methods, procedures, and components have not been described in detail so as not to obscure the present invention.

[0013] A method can be provided. According to an embodiment of the present invention, the method may include: when the PCB is supported by a mechanic...

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Abstract

The invention discloses a system and a method for inspecting a solder mask and provides a system and a method for facilitating print visual inspection. The method comprises the steps of printing patterns on a substrate area by a printing unit of the system during the printing process; inspecting the above area by means of an inspection unit of the system so as to provide an inspection result; searching defects by means of a processor of the system based on the inspection result; and upon detecting a defect, carrying out an operation of (a) repairing the substrate, or (b) performing a correction measure to improve the printing technique; or (c) performing no correction measure, in response to the defect.

Description

technical field [0001] The present invention relates to solder mask inspection. Background technique [0002] One or more printed boards (PCBs) may be included in a single panel. Prior art PCB production systems have a dedicated automated optical inspection (AOI) system separate from the printing system. The state-of-the-art PCB manufacturing process can include: (i) PCB inspection by AOI system, (ii) PCB cleaning and surface treatment; (iii) solder mask application by dedicated printing machine (which can be done by screen printing (capable of photo-image-able or not), curtain coating or spray coating (photo-image-capable)), (iv) tackfree curing; (v) UV exposure; (vi) solder mask development; (vii) solder mask inspection (performed by a dedicated system); and (viii) final curing. [0003] The process requires many panel handlings with various systems (eg, AOI, cleaning equipment, solder mask deposition equipment, etc.), significantly increasing handling-related defects t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B41M1/12B41F15/08B41F33/00
Inventor Y·切比斯N·罗赞斯坦T·塞格夫A·莱维
Owner CAMTEK LTD