Low-viscosity low-contact angle cold tolerance ultraviolet light polymerization adhesive for bonding glass and preparation method thereof

An ultraviolet light, low viscosity technology, applied in the direction of adhesives, non-polymer organic compound adhesives, etc., to achieve the effect of broad application prospects

Inactive Publication Date: 2013-04-03
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The preparation process is

Method used

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  • Low-viscosity low-contact angle cold tolerance ultraviolet light polymerization adhesive for bonding glass and preparation method thereof
  • Low-viscosity low-contact angle cold tolerance ultraviolet light polymerization adhesive for bonding glass and preparation method thereof
  • Low-viscosity low-contact angle cold tolerance ultraviolet light polymerization adhesive for bonding glass and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0034] Example 1

[0035] Table 1 selects the following components by mass percent fraction:

[0036]

[0037] The method for preparing Example 1 is: first weigh each material according to the components given in Table 1; then put the aromatic polyether urethane diacrylate into a light-tight brown glass container (select the light-proof brown glass container In order to achieve shading and prevent monomers from reacting), then sequentially pour isobornyl acrylate, hydroxyethyl acrylate, hydroxyethyl methacrylate, methyl benzoylformate, methacrylic acid and hydroxyphosphate acrylate; After a stirring speed of 60 rpm and a stirring time of 5 minutes, a uniformly stirred and mixed UV-curable adhesive was prepared.

[0038] The UV-curable adhesive prepared in Example 1 was subjected to a viscosity test. The test equipment was a British BohlinrhRH 2000 rotational rheometer, and the viscosity test method was the plate method. figure 2 It is the viscosity test result of the U...

Example Embodiment

[0042] Example 2

[0043] Table 2 selects the following components by weight percent fraction:

[0044]

[0045]

[0046] The method for preparing Example 2 is as follows: first weigh each material according to the components given in Table 2; then put aromatic polyurethane diacrylate and aromatic epoxy diacrylate into a light-tight metal container, and then sequentially Pour isobornyl acrylate, hydroxyethyl acrylate, polyethylene glycol diacrylate, methyl benzoylformate, 2,4,6-trimethylbenzoyl-diphenylphosphine oxide, acrylic acid, N- Methylol acrylamide and acrylic acid hydroxyphosphate; after a stirring speed of 40 rpm and a stirring time of 10 minutes, a uniformly stirred and mixed UV-curable adhesive is obtained.

[0047] The UV-curable adhesive prepared in Example 2 was subjected to a viscosity test. The test equipment was a British BohlinrhRH 2000 rotational rheometer, and the viscosity test method was the plate method. The test results show that the average v...

Example Embodiment

[0051] Example 3

[0052] Table 3 selects the following components by weight percent fraction:

[0053]

[0054]

[0055] The method for preparing Example 3 is: first weigh each material according to the components given in Table 3; then aromatic polyether urethane diacrylate and aliphatic polyether urethane diacrylate are put into an opaque brown glass container , and then sequentially poured into isobornyl acrylate, hydroxyethyl acrylate, trimethylolpropane triacrylate, glycidyl methacrylate, 1-hydroxycyclohexyl phenyl ketone, benzophenone, methacrylic acid , acrylic acid hydroxyphosphate and N-methylol acrylamide; at a stirring speed of 150 rpm and a stirring time of 5 minutes, a uniformly stirred and mixed UV-curable adhesive is prepared.

[0056] The UV-curable adhesive prepared in Example 3 was subjected to a viscosity test. The test equipment was a British BohlinrhRH 2000 rotational rheometer, and the viscosity test method was the plate method. The test result...

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Abstract

The invention discloses a low-viscosity low-contact angle cold tolerance ultraviolet light polymerization adhesive foe bonding glass, which comprises the following components in percentage by weight: 30%-80% of reactive diluents, 10%-45% of resin, 1%-10% of photoinitiator and 5%-15% of additive. According to the invention, low temperature resistant resin, low viscosity but high adhesive ability reactive diluents and additive which can improves the interfacial property are adopted to obtain a low-viscosity low-contact angle cold tolerance ultraviolet light polymerization adhesive for bonding glass by adjusting the flexible chain content, additive content and the resin ratio. The adhesive for bonding glass has the characteristics that the viscosity is less than 1P, the contact angle of the glass surface is less than or equal to 20 degrees, the adhesive can be used in the bonding of precise tiny components, and has a high shear strength at room temperature and a resistance at a very low temperature, thereby having a wide application prospect in the information transmission, microelectronics, superconductivity and other fields.

Description

technical field [0001] The present invention relates to an adhesive, more particularly to an ultraviolet curable adhesive used for bonding glass, having low viscosity, low contact angle and low temperature resistance. Background technique [0002] UV curing technology is a high-efficiency, energy-saving and environmentally friendly high-tech, with adjustable performance, no or low VOC (volatile organic compound) emissions, energy saving, fast curing speed, low curing temperature, high production efficiency, suitable for assembly line production , The coating equipment has the characteristics of small size, small footprint, small investment, and is suitable for coating heat-sensitive substrates. It is mainly used in the fields of coatings, inks, adhesives and other materials. [0003] In high-tech fields such as microelectronics, optics, and precision instruments, it is often necessary to assemble some tiny components. With the miniaturization and high speed of integrated ci...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J175/14
Inventor 杨继萍孙龙生黄鹏程
Owner BEIHANG UNIV
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