Polishing solution adding device
A technology for adding devices and polishing liquid, which is applied in grinding/polishing equipment, metal processing equipment, manufacturing tools, etc., can solve the problem of polishing liquid waste and achieve full utilization
Inactive Publication Date: 2013-04-17
XIAMEN UNIV
View PDF5 Cites 5 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0004] The invention aims at the problem that the traditional polishing liquid addition method causes great waste of polishing liquid, and provides a polishing liquid adding device capable of improving the utilization efficiency of the polishing liquid, reducing costs and improving the polishing effect
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0012] see figure 1 and 2 , the embodiment of the present invention is provided with workpiece fixture connecting seat 1, upper end cover 2, upper end bearing 3, upper end sealing layer 4, workpiece fixture 5, lower end cover 6, lower end bearing 7, lower end sealing layer 8, box body 9, electronic throttling Valve 10 and sleeve 11. Fixture connecting seat 1 is externally connected to the rotating shaft of the polishing machine. Fixture connecting seat 1 is screwed to the upper end of workpiece fixture 5. There is a drainage groove inside the workpiece fixture 5. The upper part of the drainage groove is a T-shaped groove 51, and the lower part of the drainage groove is 16 radially evenly distributed shunts. Slot 52. The entrance of the T-shaped groove 51 is exposed on the outer surface of the workpiece fixture 5, and the outlets of each splitter groove are distributed on the bottom surface of the workpiece fixture 5. The box body 9 is set on the outside of the workpiece fix...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a polishing solution adding device, relates to polishing equipment and provides a polishing solution adding device capable of increasing polishing solution utilization efficiency, reducing expense and improving polishing effect. The polishing solution adding device comprises a workpiece holder connecting seat, a workpiece holder, an upper end cover, a lower end cover, a box body and an electronic throttle valve; a polishing machine rotating shaft is connected to the outside of the holder connecting seat; the holder connecting seat is in threaded connection with the upper end of the workpiece holder; the workpiece holder is internally provided with a drainage groove; an inlet of the drainage groove is exposed out of the outer surface of the workpiece holder; the drainage groove is provided with at least three outlets respectively distributed on the bottom surface of the workpiece holder; the box body is sleeved outside the workpiece holder; the upper end cover and the lower end cover are respectively fixed on the upper end surface and the lower end surface of the box body; the wall of the box body is provided with a liquid through hole; the electronic throttle valve is arranged on the outer wall of the box body; a liquid outlet of the electronic throttle valve is communicated with the liquid through hole arranged in the wall of the box body and the drainage groove; and the workpiece holder is rotationally matched with the box body through a bearing.
Description
technical field [0001] The invention relates to polishing equipment, in particular to a polishing liquid adding device. Background technique [0002] Chemical Mechanical Polishing (CMP for short) was proposed by Monsanto in 1965. Under the action of the abrasive disc and the abrasive, the thin layer of the surface of the material is first softened by the chemical action of the polishing slurry, and then the abrasive and abrasive And the mechanical action of the polishing cloth will wear it off and take it away, so as to achieve planarization. It is mainly used in the manufacture of ultra-large-scale integrated circuits (ULSI), and has become a practical technology and core technology for realizing the global planarization of silicon wafers in the semiconductor processing industry ([1] Dong Wei. Research status and progress of chemical mechanical polishing technology [J]. Manufacturing Technology and Machine Tools, 2012, (07): 93-97.). [0003] Polishing liquid needs to be ...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More IPC IPC(8): B24B57/02
Inventor 郭隐彪吴沿鹏杨炜梁恺叶卉
Owner XIAMEN UNIV