Novel regeneration method of PDP (Plasma Display Panel) barrier
A new type of barrier wall technology, applied in the field of ion display barrier wall regeneration and PDP barrier wall regeneration field, to achieve the effect of reducing scrap, saving manpower and material resources, and saving production costs
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Embodiment 1
[0031] The regeneration of the barrier rib regeneration substrate produced before the coating of the barrier rib upper layer comprises the following steps:
[0032] (1) During the production process of the barrier wall, when the lower layer of the barrier wall is coated, if it needs to be regenerated due to some abnormalities such as uncoating, tailing, and mixed liquid;
[0033] (2) When the lower layer of the barrier is dry, regeneration is required due to abnormal drying;
[0034] (3) Drying the regenerated substrate in step (1) on the lower layer of the barrier;
[0035] (4) Put the regenerated substrate dried in step (3) into the barrier sintering furnace for sintering after the regenerated substrate in step (2) is off-line. The sintering conditions are the same as those in normal production, and the temperature is controlled at 563°C;
[0036] (5) After the sintering is completed, the recycled substrate is off-line and put into the barrier etching machine;
[0037] (6...
Embodiment 2
[0047] The upper layer of the barrier is applied to the regeneration of the regenerated substrate in the barrier sintering furnace, including the following steps:
[0048] (1) During the production process of the barrier, when the upper layer of the barrier is coated, if it needs to be regenerated due to some abnormalities such as uncoating, tailing, and mixed liquid;
[0049] (2) When the upper layer of the barrier is dry, regeneration is required due to abnormal drying;
[0050](3) Drying the regenerated substrate in step (1) on the upper layer of the barrier;
[0051] (4) Flow the regenerated substrate dried in step (3) together with the regenerated substrate in step (2) to the barrier sintering furnace for sintering, the sintering conditions are the same as those in normal production, and the temperature is set at 564°C;
[0052] (5) After the sintering is completed, the recycled substrate is taken off the assembly line and put into a barrier etching machine;
[0053] (6...
Embodiment 3
[0058] The regeneration of the substrate with an abnormal sintered barrier film layer and the substrate with poor pattern and size of the barrier rib includes the following steps:
[0059] (1) After the sintering of the barrier, due to abnormalities on the surface of the film layer, some scratches, cracks, round spots, etc., such substrates need to be regenerated;
[0060] (2) In the process of graphics production, since the shape of the barrier does not meet the requirements of the process specifications or the scrapped surface of the substrate is ≥ 2cell / sheet, such substrates need to be regenerated;
[0061] (3) Offline the regenerated substrates in steps (1) and (2) and put them into the barrier etching machine;
[0062] (4) To change the process conditions of the barrier etching machine, only the speed process parameters should be changed to ≤3000mm / min; the other process parameters can not be changed, and the etching conditions in normal production should be followed.
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