Golden finger processing method, printed circuit board manufacturing method, golden finger and printed circuit board

A technology of printed circuit boards and processing methods, which is applied in the fields of printed circuit manufacturing, printed circuits, printed circuit components, etc., can solve problems such as copper tailing, achieve the effect of improving production efficiency and ensuring production quality

Inactive Publication Date: 2013-04-17
PEKING UNIV FOUNDER GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention aims to provide a gold finger processing method and a PCB manufacturing method to solve the problem of copper tailing in gold finger milling processing

Method used

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  • Golden finger processing method, printed circuit board manufacturing method, golden finger and printed circuit board
  • Golden finger processing method, printed circuit board manufacturing method, golden finger and printed circuit board
  • Golden finger processing method, printed circuit board manufacturing method, golden finger and printed circuit board

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Embodiment Construction

[0014] The present invention will be described in detail below with reference to the accompanying drawings and in combination with embodiments.

[0015] figure 1 A flow chart showing a gold finger processing method according to an embodiment of the present invention includes:

[0016] Step S10, during the process of making the PCB, rough milling is performed on the lead part of the golden finger of the PCB;

[0017] In step S20, fine milling is performed on the rough milled lead part.

[0018] In the conventional milling process, only the rough milling process is performed on the lead part of the gold finger (that is, the lead wire of the gold finger and the base material part to which the lead wire is attached), so the problem of copper skin smearing occurs, while the existing alkaline etching method Neither the manual scraping method nor the manual scraping method can solve this problem well. In this embodiment, two steps are used to process the lead part of the gold fing...

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Abstract

The invention provides a golden finger processing method. The method comprises the following steps of performing rough milling for a lead part of a golden finger of a PCB (printed circuit board) during manufacturing the PCB, and performing finish-milling for the lead part which is rough milled. The invention provides a PCB manufacturing method, the method comprises the following steps of performing rough milling for a lead part of a golden finger of a PCB, and performing finish-milling for the lead part which is rough milled. The invention further provides a golden finger and a printed circuit board. The golden finger processing method, the printed circuit board manufacturing method, the golden finger and the printed circuit board provided by the invention can be used for improving the production efficiency and ensuring the production quality.

Description

technical field [0001] The invention relates to the field of printed circuit boards (PCBs), in particular to a golden finger processing method, a PCB manufacturing method, golden fingers and a printed circuit board. Background technique [0002] The metal terminals of the PCB are called golden fingers. In the process of making the PCB, in order to improve the quality of the gold finger, it is necessary to perform forming processing on the lead of the gold finger, that is, milling. [0003] During the milling process, the lead wire may be continuously cut, resulting in residual copper wire. This phenomenon is called copper skin tailing. There are two ways to deal with the problem of copper skin smearing: one is to use alkaline etching for processing, the processing process is complicated and affects the delivery, and the alkaline etching process often brings other quality problems; the other is to pass through after milling. Manually scraping off the residual copper wire of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/40H05K1/11
Inventor 陈显任黄承明
Owner PEKING UNIV FOUNDER GRP CO LTD
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