Semiconductor package

Abstract

A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The distance between the conductive pillar and the conductive trace is less than or equal to about 16 mum.

Description

technical field [0001] The present invention relates generally to the field of semiconductors, and more particularly, to semiconductor packages. Background technique [0002] An integrated circuit chip includes semiconductor devices formed over a substrate, such as a semiconductor wafer, and includes metallized contact pads that provide the electrical interface to the integrated circuit. Bonding bumps are part of the interconnect structure in integrated circuits. The bumps provide an interface to the integrated circuit device through which electrical connections to the device can be made. The technique of providing a connection between the internal circuitry of a chip, such as a circuit board, other chips, or a wafer, including wire bonding, in which wires are used to connect the chip's contact pads to external circuitry, and possibly also known in the art. other technologies. A more recent chip-attachment technique, known as flip-chip technology, uses solder bumps deposi...

AI Technical Summary

Problems solved by technology

The resulting flip-chip package is much smaller than traditional carrier-based systems, making the interconnection wires potentially much shorter due to the chip being positioned directly above the external circuitry

Images