Novel ladder microwave plate
A microwave board and ladder technology, which is applied in the field of microwave boards, can solve problems that affect product appearance and performance, complex process flow, and low pass rate, and achieve the effects of shortening the production cycle, simplifying the process, and improving product quality
Active Publication Date: 2015-07-01
SHANGHAI FAST PCB CIRCUIT TECH CORP LTD
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Problems solved by technology
In processing, the PP is usually enlarged according to the amount of glue overflow of the curing sheet or the special glue-resisting pad is used. The process is complicated and subject to many factors such as the pressing conditions, the residual copper rate of the inner layer, and the way of pressing and arranging boards. Influence, resulting in large and small overflow glue
The pass rate is not high, seriously affecting the appearance and performance of the product
Method used
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Embodiment Construction
[0021] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0022] Such as figure 1 and figure 2 As shown, the present invention includes inner microstrip line 2, PTFE prepreg 4, slot 5, separation film 6, inner microstrip line copper layer 7, low TG value prepreg 8, PTFE material substrate 9, 10, plug-in hole 11; From top to bottom, the low TG value prepreg 8, the separation film 6, the PTFE material substrate 9, the PTFE prepreg 4, the inner microstrip line 2 and the PTFE material substrate 10 are superimposed in order, and the inner microstrip line 2 and the PTFE prepreg 4 have The copper layer 7 of the inner microstrip line, the separation film 6 and the low TG value prepreg 8 are not bonded, and play a role of separation. The slot 5 during pressing is located on the PTFE material substrate 9, and the plug-in hole 11 is located in the microstrip line in the groove superior.
[0023] The presen...
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The invention relates to a novel ladder microwave plate. The ladder microwave plate comprises an inner microstrip line, a PTFE prepreg, a notching, a separating membrane, an internal layer microstrip line copper layer, a low TG value prepreg, an upper layer PTFE material substrate, a lower layer PTFE material substrate and a plug-in hole. The low TG value prepreg, the separating membrane, the upper layer PTFE material substrate, the PTFE prepreg, the inner microstrip line and the lower layer PTFE material substrate are successively arranged from top to bottom. The internal layer microstrip line copper layer is arranged between the inner microstrip line and the PTFE prepreg. The notching is arranged on the upper layer PTFE material substrate. The plug-in hole is arranged on the inner microstrip line in the notching. Compared to the prior art, by using the plate of the invention, there are the following advantages that a manufacturing flow is simple; cost is low; performance is high and so on.
Description
technical field [0001] The invention relates to a microwave board, in particular to a stepped microwave board. Background technique [0002] At present, the processing method of microwave stepped plates usually adopts Low flow PrePreg lamination, but due to electrical performance and special use environment requirements, most microwave stepped plates cannot use Low flow PrePreg. On the contrary, PrePreg pressing with a large amount of glue flow is required. In processing, the PP is usually enlarged according to the amount of glue overflow of the curing sheet or a special glue-resisting pad is used. The process is complicated and subject to many factors such as the pressing conditions, the residual copper rate of the inner layer, and the way of pressing and arranging boards. Affected, resulting in large and small overflow glue. The pass rate is not high, which seriously affects the appearance and performance of the product. Contents of the invention [0003] The object o...
Claims
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IPC IPC(8): H05K1/02
Inventor 唐永成
Owner SHANGHAI FAST PCB CIRCUIT TECH CORP LTD