Headphones with pressure equalizer

A pressure equalizing device and earphone technology, which is applied in earpiece/earphone accessories, on-ear/around-ear earphones, sensors, etc., can solve the problems of reduced comfort of earphones, stuffy sound quality of earphones, and unbalanced sound quality of earphones, etc., to achieve Effect of reducing low-frequency energy leakage and sound quality balance

Active Publication Date: 2016-06-08
QINGDAO GOERTEK
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  • Summary
  • Abstract
  • Description
  • Claims
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AI Technical Summary

Problems solved by technology

For earphones of this structure, pressure is easily generated in the front acoustic cavity formed by combining the earmuffs with the earphone front shell, and in the rear acoustic cavity formed by the combination of the earphone front shell and the earphone rear shell, resulting in sound waves unable to pass naturally
For example, when the sound quality of the earphones is stuffy and depressed, when the airflow in the front cavity impacts the speaker diaphragm and the human eardrum, the diaphragm is deformed by the impact of the strong airflow, resulting in abnormal sound quality, which reduces the comfort of wearing the earphone and increases the distortion of the earphone. Big
In order to solve this problem, some existing earphones have pressure relief grooves or holes at the edge joint of the earphone front shell and the earphone rear shell, but the pressure relief grooves or holes will cause a large leakage of sound low-frequency energy, making the sound quality of the earphones unbalanced

Method used

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  • Headphones with pressure equalizer
  • Headphones with pressure equalizer
  • Headphones with pressure equalizer

Examples

Experimental program
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Embodiment Construction

[0015] figure 1 It is a structural schematic diagram of an earphone with a pressure equalizing device of the present invention, figure 2 yes figure 1 The enlarged schematic diagram of part A in the middle, image 3 yes figure 1 The partial cross-sectional view of the sandwich type acoustic resistance device in , such as figure 1 , figure 2 with image 3 Commonly shown, the earphone with a pressure equalizing device of the present invention includes an earphone front shell 2 and an earphone rear shell 1, earmuffs 3 are arranged on the outside of the earphone front shell 2, and a front sound hole is provided on the earphone front shell 2 5. A sandwich-type acoustic resistance device 6 is sandwiched between the edge joints of the earmuffs 3 and the earphone front shell 2 and the edge joints of the earphone front shell 2 and the earphone rear shell 1 . The sandwich type acoustic resistance device 6 includes two layers of plywood 61 , and an acoustic resistance device 62 is...

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PUM

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Abstract

Disclosed is a headset with a pressure equalizing function. The headset comprises a headset front housing and a headset rear housing, wherein ear sleeves are provided at the outer side of the headset front housing; a front acoustic hole is formed in the headset front housing; and sandwich type acoustic resistance devices are arranged at the edge juncture of the ear sleeves and the headset front housing and at the edge juncture of the headset front housing and the headset rear housing respectively. According to the headset with a pressure equalizing function of the present invention, low-frequency energy leakage can be reduced when pressure of a front acoustic cavity and a rear acoustic cavity of the headset is released, so that the headset is comfortable to wear without feeling of pressure, and the acoustic quality is balanced.

Description

technical field [0001] The invention relates to the technical field of earphones, in particular to an earphone with a pressure equalizing device. Background technique [0002] Existing earphones comprise earphone front shell and earphone rear shell, and earphone front shell is provided with earmuff, and earphone rear shell is closed type or semi-closed type, and earmuff adopts airtight leather earmuff sometimes. For earphones of this structure, pressure is easily generated in the front acoustic cavity formed by combining the earmuffs with the earphone front shell, and in the rear acoustic cavity formed by the combination of the earphone front shell and the earphone rear shell, resulting in sound waves Unable to pass normally and naturally. For example, when the sound quality of the earphones is stuffy and depressed, when the airflow in the front cavity impacts the speaker diaphragm and the human eardrum, the diaphragm is deformed by the impact of the strong airflow, resulti...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04R1/10
CPCH04R1/2892H04R1/1008H04R1/2803
Inventor 林孟钊
Owner QINGDAO GOERTEK
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