Light emitting device package with enhanced heat transfer
A light-emitting device packaging and packaging technology, which is applied in the direction of semiconductor devices, electric solid-state devices, semiconductor devices, etc. difficult access issues
Active Publication Date: 2016-12-07
CREELED INC (N D GES D STAATES DELAWARE NEWARK)
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, adequate contact between the PCB and heat sink is more difficult because, to ensure adequate heat transfer, ideally the entire bottom surface of the heat sink needs to be wetted by solder to minimize voids
Existing LED package designs can result in insufficient wetting of the surface of the heat sink, thereby insufficiently soldering to the PCB, and thus reducing the reliability and heat dissipation of the LED package
If not sufficiently wetted, there can be voids between the bottom surface of the heat transfer material and the PCB, causing problems with poor heat transfer and heat dissipation
Method used
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[0034] The subject matter herein will now be described in detail as possible embodiments of the subject matter herein, one or more examples of which are illustrated in the figures. Each example is provided by way of explanation of subject matter, not limitation. Indeed, features illustrated or described as part of one embodiment can be used on another embodiment to yield a still further embodiment. It is the intention of the subject matter disclosed and conceived herein to embrace such modifications and variations.
[0035] As shown in the various figures, the dimensions of some structures or portions are exaggerated relative to others for illustrative purposes, and are therefore provided to facilitate illustrating the general structure of the subject matter. Furthermore, various aspects of the subject matter are described in terms of one structure or portion, or both, being formed on other structures and / or portions. Those skilled in the art will understand that reference t...
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Packages containing one or more light emitting devices, such as light emitting diodes (LEDs), are disclosed. In one embodiment, the LED package may include a thermal element with improved soldering reliability in order to increase the heat dissipation capability of the LED package. An LED package can include a molded plastic body with one or more LEDs attached to one or more electrical components. The LED may be attached to the upper surface of the thermal element. The thermal element may include a bottom surface that may extend a greater distance from the body of the LED package than the bottom surface of the electrical element. This configuration improves the connection between the LED package and an external circuit source, thereby improving the heat transfer capability of the LED package.
Description
[0001] related application [0002] This application claims the benefit of US Patent Application Serial No. 12 / 825,075, filed June 28, 2010, which is hereby incorporated by reference in its entirety. technical field [0003] The subject matter disclosed herein relates generally to packages (packages) for light emitting devices. More specifically, the subject matter disclosed herein relates to light emitting device packages with improved heat transfer. Background technique [0004] For example, light emitting devices such as light emitting diodes (LEDs) are usually packaged in a case of a surface mounted device (SMD). These housings are usually made of plastic and are called Plastic Leaded Chip Carriers (PLCCs). SMD housings are often characterized by an LED connected to a plurality of metal leads. Portions of the leads may be molded into the plastic body, while other portions may protrude and extend outside the plastic body. The molded plastic body can define mirrors for...
Claims
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IPC IPC(8): F21V29/503F21V29/70F21V23/00F21Y115/10
CPCH01L25/0753H01L33/486H01L33/642H01L2924/09701H01L2224/48091H01L2924/12032H01L2224/48247H01L2224/49113H01L2924/00014H01L2924/00H01L33/60H01L33/647
Inventor 克勒斯托弗·P·胡赛尔朱晟喆罗伯特·肖恩·派尔斯
Owner CREELED INC (N D GES D STAATES DELAWARE NEWARK)