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Bonding structure, electronic device with bonding structure and bonding method

An electronic device and bonding technology, which is applied in the direction of electronic equipment, laminating devices, chemical instruments and methods, etc., can solve the problems of manpower, material resources, glue overflow, etc., reduce the consumption of manpower and material resources, and reduce the defectiveness of products Effect

Active Publication Date: 2013-05-08
TPK TOUCH SOLUTIONS (XIAMEN) INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, optical adhesives are divided into solid adhesives and liquid adhesives. However, with the promotion of liquid adhesive materials, people gradually abandon solid adhesives and use liquid adhesives more and more. However, liquid adhesives may overflow during the lamination process, etc. Problem, in actual production, the method of glue scraping and glue removal is generally used to solve the problem of glue overflow, but it takes a lot of manpower and material resources

Method used

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  • Bonding structure, electronic device with bonding structure and bonding method
  • Bonding structure, electronic device with bonding structure and bonding method
  • Bonding structure, electronic device with bonding structure and bonding method

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Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] figure 1 and figure 2 The bonding structure of the present invention is shown. figure 1 It is a top view of the bonding frame formed in the peripheral area of ​​the first substrate of the present invention, figure 2 It is a side view of the bonding frame formed in the peripheral area of ​​the first substrate of the present invention. The bonding structure includes a bonding frame 16, which is arranged on the peripheral area of ​​a first substrate 12, and forms a bonding region 121 on the first substrate 12, which is used for coating liquid adhesive glue, so that the The liquid adhesive glue is filled with the attaching area 121 to form a liquid adhesive layer for attaching another substrate. The adhesive frame 16 is an adhesive of elastic polymer compound (such as epoxy resin or acrylic resin).

[0022] Such as figure 1...

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Abstract

The invention provides a bonding structure, an electronic device with the bonding structure and a bonding method. The bonding structure comprises a bonding frame which is arranged at a peripheral zone of a first substrate, the surface of the bonding frame comprises a plurality of bulges, and a gap is arranged between every two adjacent bulges so as to accommodate an overflow part of a liquid adhesive glue. According to the invention, in virtue of the patterned bonding frame, the problem of glue-spilling in the process of bonding of substrates is overcome, scraping and cleaning of the glue in the whole bonding process are not needed, so cost for manpower and material resources is reduced.

Description

technical field [0001] The present invention relates to a bonding technology, in particular to a bonding structure, an electronic device with the bonding structure and a bonding method thereof. Background technique [0002] Optical Clear Adhesive (OCA) is widely used in electronic devices such as portable phones, personal digital assistants, global positioning systems, and laptop computers, as a bonding material between internal components of such electronic devices. Generally, optical adhesives are divided into solid adhesives and liquid adhesives. However, with the promotion of liquid adhesive materials, people gradually abandon solid adhesives and use liquid adhesives more and more. However, liquid adhesives may overflow during the lamination process. The problem is that in actual production, glue scraping and glue removal are generally used to solve the problem of glue overflow, but it takes a lot of manpower and material resources. Contents of the invention [0003] ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/12
CPCB32B2310/0831G06F3/041B32B37/12B32B2037/1253B32B2457/208B32B37/1284Y10T428/24488B32B7/12H05K1/02
Inventor 李裕文林奉铭阮克铭
Owner TPK TOUCH SOLUTIONS (XIAMEN) INC
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