Copper-based boss plate and pressing method thereof

Abstract

The invention discloses a copper-based boss plate and a pressing method of the copper-based boss plate. The pressing method includes the steps that A, copper foil is coated with a heat-conducting glue layer through a coating machine; B, a screen printing film is virtually attached to a heat-conducting glue face; C, the copper foil is placed between aluminum sheets, the temperature is transmitted to a screen printing film through the aluminum sheets by means of a film sticking machine, and the screen printing film is heated to be pasted to the heat-conducting glue; D, the copper foil is cut to be equal to a copper base in size through a cutting machine; E, a boss is formed on the copper foil in a punched mode through a die; F, the screen printing film on the heat-conducting glue face is removed, and the copper foil is riveted with the copper-based boss. The copper-based boss plate is made in a mode that the copper foil is coated with the heat-conducting glue, necking can be conducted on the die directly, the heat-conducting glue is poor in mobility so that the problem of glue overflowing cannot happen, and the necking manufacturing can be finished by just opening the one die; compared with a traditional method wherein two dies need to be opened, cost is reduced and production efficiency is improved as well.

Description

technical field [0001] The invention relates to the field of printed circuit board production, in particular to a copper-based boss board and a pressing method thereof. Background technique [0002] With the rapid development of the circuit board industry, there are more and more high-power and high-current products, which also put forward higher requirements for product production efficiency. The traditional PCB production technology is to directly groove on the core board and PP, and then Riveted with copper base. Since PP is easy to stick to the knife during the production process, the number of PP gongs should not be too much at one time, which leads to a long cycle and slow efficiency during mass production of PCBs, which cannot meet the requirements of mass production. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention [0004] In view of the above-mentioned deficiencies in the prior art, the object of the present ...

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Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a copper-based boss plate and its pressing method, aiming at solving the problem of low production efficiency of the existing copper-based boss plate

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