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Bonding structure, electronic device with the bonding structure and bonding method thereof

一种电子装置、黏结的技术，应用在电子器材、层压装置、化学仪器和方法等方向，能够解决溢胶、耗费人力、物力等问题，达到降低人力与物力之耗费、减少产品的不良的效果

Active Publication Date: 2016-04-06
TPK TOUCH SOLUTIONS (XIAMEN) INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Generally, optical adhesives are divided into solid adhesives and liquid adhesives. However, with the promotion of liquid adhesive materials, people gradually abandon solid adhesives and use liquid adhesives more and more. However, liquid adhesives may overflow during the lamination process, etc. Problem, in actual production, the method of glue scraping and glue removal is generally used to solve the problem of glue overflow, but it takes a lot of manpower and material resources

Method used

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  • Bonding structure, electronic device with the bonding structure and bonding method thereof
  • Bonding structure, electronic device with the bonding structure and bonding method thereof
  • Bonding structure, electronic device with the bonding structure and bonding method thereof

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Embodiment Construction

[0020] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0021] figure 1 and figure 2 The bonding structure of the present invention is shown. figure 1 It is a top view of the bonding frame formed in the peripheral area of ​​the first substrate of the present invention, figure 2 It is a side view of the bonding frame formed in the peripheral area of ​​the first substrate of the present invention. The bonding structure includes a bonding frame 16, which is arranged on the peripheral area of ​​a first substrate 12, and forms a bonding region 121 on the first substrate 12, which is used for coating liquid adhesive glue, so that the The liquid adhesive glue is filled with the attaching area 121 to form a liquid adhesive layer for attaching another substrate. The adhesive frame 16 is an adhesive of elastic polymer compound (such as epoxy resin or acrylic resin).

[0022] Such as figure 1...

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Abstract

The present invention provides a bonding structure, an electronic device with the bonding structure and a bonding method thereof. The bonding structure includes an adhesive frame, which is arranged on a peripheral area of ​​a first substrate, and the surface of the adhesive frame includes a plurality of protrusions objects, and there is a gap between each two adjacent protrusions to accommodate the overflow of a liquid adhesive. The present invention forms a patterned adhesive frame so that no glue overflow occurs during the bonding process between the substrate and the substrate. Therefore, the entire bonding process does not need to be scraped and cleaned, and the cost of manpower and material resources can be reduced. .

Description

technical field [0001] The present invention relates to a bonding technology, in particular to a bonding structure, an electronic device with the bonding structure and a bonding method thereof. Background technique [0002] Optical Clear Adhesive (OCA) is widely used in electronic devices such as portable phones, personal digital assistants, global positioning systems, and laptop computers, as a bonding material between internal components of the electronic devices. Generally, optical adhesives are divided into solid adhesives and liquid adhesives. However, with the promotion of liquid adhesive materials, people gradually abandon solid adhesives and use liquid adhesives more and more. However, liquid adhesives may overflow during the lamination process. The problem is that in actual production, glue scraping and glue removal are generally used to solve the problem of glue overflow, but it takes a lot of manpower and material resources. Contents of the invention [0003] T...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/12
CPCB32B37/1284B32B2037/1253B32B2310/0831B32B2457/208G06F3/041Y10T428/24488B32B7/12B32B37/12H05K1/02
Inventor 李裕文林奉铭阮克铭
Owner TPK TOUCH SOLUTIONS (XIAMEN) INC
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