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PCB, manufacturing method thereof and electronic equipment

A technology of PCB board and manufacturing method, applied in chemical/electrolytic methods to remove conductive materials, printed circuits, electrical components, etc., can solve the problems of reducing the thickness of PCB boards, the flatness of PCB overflow glue, etc., and achieve the resolution of board thickness problem effect

Active Publication Date: 2021-11-23
SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of this application is to provide a PCB board and its manufacturing method, electronic equipment, to solve the problem of glue overflow and poor flatness of the PCB board, and reduce the thickness of the PCB board

Method used

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  • PCB, manufacturing method thereof and electronic equipment
  • PCB, manufacturing method thereof and electronic equipment
  • PCB, manufacturing method thereof and electronic equipment

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Embodiment Construction

[0038] In order to enable those skilled in the art to better understand the solution of the present application, the present application will be further described in detail below in conjunction with the drawings and specific implementation methods. Apparently, the described embodiments are only some of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0039] In the following description, a lot of specific details are set forth in order to fully understand the present invention, but the present invention can also be implemented in other ways different from those described here, and those skilled in the art can do it without departing from the meaning of the present invention. By analogy, the present invention is therefore not limited to the specific examples disclosed bel...

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Abstract

The invention discloses a PCB (Printed Circuit Board), a manufacturing method thereof and electronic equipment. The method comprises the following steps: etching a first surface of a copper plate to manufacture a first circuit pattern; filling resin in the first circuit pattern and curing the resin; etching a groove in a non-circuit pattern area of the first surface, filling resin in the groove, and curing the resin to obtain a treated copper plate; placing the treated copper plates on the two sides of the prepreg respectively, and pressing the plates; manufacturing a second circuit pattern on the second surface of the copper plate after etching the pressing plate, wherein the second circuit pattern corresponds to the first circuit pattern; filling resin in the second circuit pattern and curing the resin; etching the copper plate outside the corresponding areas of the first circuit pattern and the second circuit pattern and the corresponding area of the current circuit layer, and filling resin and curing resin in the etched areas to obtain a preprocessed circuit board with a copper block on the inner layer; and performing outer-layer pattern manufacturing on the pre-processed circuit board to obtain the PCB. The PCB is flat in surface, free of glue overflow and thin in thickness.

Description

technical field [0001] The present application relates to the field of semiconductors, in particular to a PCB board, a manufacturing method thereof, and electronic equipment. Background technique [0002] In recent years, printed circuit boards (Printed Circuit Boards) with ultra-thick copper or buried copper blocks have been widely used in the electronics field to provide the necessary electrical connections and mechanical support for electronic components. Ultra-thick copper / buried copper PCBs Has broad market prospects. [0003] At present, when preparing embedded copper or thick copper PCB boards, the embedded method is used to etch grooves on the substrate, inject glue into the grooves, and then embed the copper blocks for pressing. On the one hand, glue overflow is prone to occur. On the other hand, due to the different materials of the copper block and the substrate, the bonding is poor during pressing, and the surface of the copper block is higher than the surface o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/06
CPCH05K3/00H05K3/067H05K3/06
Inventor 汪亚军张永甲
Owner SUZHOU LANGCHAO INTELLIGENT TECH CO LTD
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