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A copper-based boss plate and its pressing method

A copper-based boss, copper-based technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problem of low production efficiency of copper-based boss boards, and achieve the effect of improving production efficiency and reducing costs

Active Publication Date: 2017-02-01
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a copper-based boss plate and its pressing method, aiming at solving the problem of low production efficiency of the existing copper-based boss plate

Method used

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  • A copper-based boss plate and its pressing method

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Embodiment Construction

[0021] The present invention provides a copper-based boss plate and its pressing method. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] see figure 1 , figure 1 It is a flow chart of a preferred embodiment of the pressing method of a copper-based boss plate of the present invention, as shown in the figure, which includes steps:

[0023] S101, using a coating machine to coat a layer of thermal conductive adhesive on the copper foil;

[0024] S102, falsely pasting the silk screen film on the thermally conductive adhesive surface;

[0025] S103. Place the copper foil between the aluminum sheets, and use a film laminating machine to transfer the temperature to the silk screen film through the alumi...

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Abstract

The invention discloses a copper-based boss plate and a pressing method of the copper-based boss plate. The pressing method includes the steps that A, copper foil is coated with a heat-conducting glue layer through a coating machine; B, a screen printing film is virtually attached to a heat-conducting glue face; C, the copper foil is placed between aluminum sheets, the temperature is transmitted to a screen printing film through the aluminum sheets by means of a film sticking machine, and the screen printing film is heated to be pasted to the heat-conducting glue; D, the copper foil is cut to be equal to a copper base in size through a cutting machine; E, a boss is formed on the copper foil in a punched mode through a die; F, the screen printing film on the heat-conducting glue face is removed, and the copper foil is riveted with the copper-based boss. The copper-based boss plate is made in a mode that the copper foil is coated with the heat-conducting glue, necking can be conducted on the die directly, the heat-conducting glue is poor in mobility so that the problem of glue overflowing cannot happen, and the necking manufacturing can be finished by just opening the one die; compared with a traditional method wherein two dies need to be opened, cost is reduced and production efficiency is improved as well.

Description

technical field [0001] The invention relates to the field of printed circuit board production, in particular to a copper-based boss board and a pressing method thereof. Background technique [0002] With the rapid development of the circuit board industry, there are more and more high-power and high-current products, which also put forward higher requirements for product production efficiency. The traditional PCB production technology is to directly groove on the core board and PP, and then Riveted with copper base. Since PP is easy to stick to the knife during the production process, the number of PP gongs should not be too much at one time, which leads to a long cycle and slow efficiency during mass production of PCBs, which cannot meet the requirements of mass production. [0003] Therefore, the prior art still needs to be improved and developed. Contents of the invention [0004] In view of the above-mentioned deficiencies in the prior art, the object of the present ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00
Inventor 邓昱李仁荣邹子誉
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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