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Circuit board and circuit board manufacturing method

A circuit board manufacturing, circuit board technology, applied in the directions of printed circuit manufacturing, printed circuits, circuit thermal devices, etc., can solve problems such as overflowing glue

Pending Publication Date: 2021-09-10
KINWONG ELECTRONICS TECH LONGCHUAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The invention provides a circuit board and a method for manufacturing the circuit board to solve the glue overflow problem existing in the process of pressing the heat conduction block on the existing circuit board

Method used

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  • Circuit board and circuit board manufacturing method
  • Circuit board and circuit board manufacturing method
  • Circuit board and circuit board manufacturing method

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Embodiment Construction

[0040] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings, that is, embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0041] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0042] In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be interpreted as indicating or implying relative importance or implicitly specifying the quantity of indicated technical features. Th...

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PUM

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Abstract

The invention relates to the technical field of circuit board manufacturing, and provides a circuit board which comprises a substrate and a heat conduction block. The substrate comprises at least two core boards which are sequentially stacked from top to bottom, a first prepreg is stacked between every two adjacent core boards, and a containing groove is formed in the upper surface of the substrate; and the heat conduction block is arranged in the containing groove, and the upper surface of the heat conduction block is higher than the upper surface of the substrate. The invention further provides a circuit board manufacturing method. According to the circuit board and the manufacturing method, the heat conduction block is arranged in the containing groove, effective heat conduction can be carried out on the circuit board, meanwhile, the upper surface of the heat conduction block is higher than the upper surface of the substrate, the problem of glue overflowing in the heat conduction block pressing process can be solved, and the quality of the circuit board is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a circuit board and a method for manufacturing the circuit board. Background technique [0002] In order to improve the thermal conductivity of the commonly used circuit boards at present, it is often necessary to embed a heat-conducting block inside the circuit board to achieve the purpose of improving the thermal conductivity and thereby improve the quality of the circuit board. The existing method of embedding the heat conduction block is to first place the heat conduction block in the accommodating groove, and then obtain the circuit board by pressing. However, the existing circuit board often has the problem of glue overflow during the process of pressing the heat conduction block. Contents of the invention [0003] The invention provides a circuit board and a manufacturing method of the circuit board to solve the glue overflow problem existing in the p...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K3/00
CPCH05K1/0204H05K3/00
Inventor 叶志峰肖安云谢光前
Owner KINWONG ELECTRONICS TECH LONGCHUAN
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