Fixing device for testing pulling-out force of device chip

A technology for fixing devices and device chips, which is applied in the direction of measuring devices, mechanical devices, instruments, etc., can solve the problems that the pulling force and the bonding surface of the device are absolutely vertical, and the separation force cannot be accurately recorded, so as to achieve simple structure and easy manufacturing. The effect of low cost and high reliability

Active Publication Date: 2013-05-22
CHINA ACADEMY OF SPACE TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The above two methods are mainly unable to ensure that the pulling force and the bonding surface of the device are absolutely vertical, and secondly, it is impossible to accurately record the size of the separation force

Method used

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  • Fixing device for testing pulling-out force of device chip
  • Fixing device for testing pulling-out force of device chip
  • Fixing device for testing pulling-out force of device chip

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Experimental program
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Embodiment Construction

[0032] The invention will be further described below in conjunction with the accompanying drawings and embodiments.

[0033] Such as figure 1 As shown, the present invention provides a fixture device chip pull-off force test, the device includes a base, a rotating holder is inserted into the base, and a fastening screw is used to fix the rotating holder in the vertical direction . The rotating holder is equipped with a holder and a bracket, and a chip bonder passes through a hole in the bracket and is fixed on it.

[0034] This device needs to be used in conjunction with the chip shear force meter. The chip shear force meter is a device with a base platform that can apply thrust horizontally. It is a general-purpose device on the market. Using this device can convert thrust into pulling force, and skillfully use the horizontal thrust of existing equipment to realize the vertical upward pulling force required by the test method in the military standard.

[0035] The lower pa...

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PUM

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Abstract

The invention discloses a fixing device for testing the pulling-out force of a device chip; the device comprises a base; a rotary holder is sheathed into the base; the device also comprises a fastening screw which is used for fixing the rotary holder along the vertical direction; the rotary holder is assembled with a clamp device and a bracket; and a chip bonding device passes through a hole in the bracket and is fixed on the bracket. The fixing device is simple in structure, convenient to install, high in vertical accuracy, high in reliability and test accuracy, low in manufacturing cost and good in market prospect.

Description

technical field [0001] The invention relates to a fixing device for device chip pull-off force test. Background technique [0002] There are many ways to package components. Among them, many components of integrated circuits are fixed in the cavity of ceramic or metal shells with chips. The device chips are mainly bonded with conductive adhesives, alloys or organic adhesives. Therefore, chips If the bonding is not strong, if the chip and the shell are separated in the later use, it will cause the function of the device to fail, and more seriously, it may cause a short circuit between the entire chip bonding wires, so it will affect the bonding strength of the chip. It is very necessary to carry out the assessment. In the method 2031 of GJB548B and the US military standard MIL-883G: flip-chip pull-off test, it is clearly required to measure the bonding strength between the semiconductor chip and the substrate connected by the surface bonding structure. Therefore, this test i...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N19/04
Inventor 王旭段超陈雁孟猛龚欣张伟姬青张延伟
Owner CHINA ACADEMY OF SPACE TECHNOLOGY
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