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Chip picking device

A chip and die-bonding technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of low work efficiency, high operator requirements, low yield, etc., to improve work efficiency and wide applicability. , Guaranteed quality effect

Inactive Publication Date: 2013-05-22
YANGZHOU YANGJIE ELECTRONIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Manual operation has brought a lot of trouble to the picking work, resulting in low work efficiency, low yield, and high requirements for operators, which is not conducive to chip picking

Method used

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Experimental program
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Embodiment Construction

[0015] The invention as Figure 1-3 As shown, it includes a crystal-bonding arm 2, a follower arm 10, a rotating shaft 1, a stretching frame 3 and a stretching frame 6. The head of the die-bonding arm 2 is provided with a suction nozzle 8, and the head of the follow-up arm 10 is provided with a thimble. 9. The tail of the die-bonding arm 2 and the tail of the follower arm 10 are connected through the rotating shaft 1, and the die-bond arm 2 is located above the follower arm 10;

[0016] The stretcher frame 3 is stretched with a blue film 4 for placing the chip 5 , and the stretcher frame 3 is arranged on the stretcher frame 6 and is located between the suction nozzle 8 and the thimble pin 9 .

[0017] The thimble 9 is coaxial with the suction nozzle 8 .

[0018] The suction nozzle 8 on the die-bonding arm 2 and the thimble on the follower arm 10 move synchronously. Synchronous movement makes the ejector pin 9 lift up the chip 5, and at the same time, the negative pressure of...

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Abstract

The invention relates to a chip picking device, and provides a chip picking device which is simple in structure and convenient to use, and improves work efficiency. The chip picking device comprises a fixed crystal arm, a following arm, a rotary shaft, a stretched frame and a stretched frame support, wherein the head of the fixed crystal arm is provided with a suction nozzle, the head of the following arm is provided with a thimble, the tail portion of the fixed crystal arm is connected with the tail portion of the following arm through the rotary shaft, the fixed crystal is placed above the following arm, a blue film used for placement of chips is placed on the stretching frame in a stretching mode, and the stretching frame is arranged on the stretching frame support and located between the suction nozzle and the thimble. According to the chip picking device, chips are picked to a graphite boat one by one through a swing arm type device, work efficiency is improved, the thimble and the suction nozzle are arranged in a coaxial mode in work, and the fact that the chips can no be inclined during a rising process is guaranteed. The chip picking device not only improves work efficiency, but also guarantees quality of material and is wide in applicability.

Description

technical field [0001] The invention relates to a pick-up device for chips. Background technique [0002] At present, the traditional method of picking up chips is: using a suction pen to absorb the stripped chips one by one into the graphite boat one by one, and requiring the operators to wear gloves, masks, electrostatic rings, electrostatic clothes, electrostatic caps, etc. to meet the Schottky chip cleanliness and anti-static requirements. Manual operation has brought a lot of trouble to the picking work, resulting in low work efficiency, low yield, and high requirements for operators, which is not conducive to chip picking. Contents of the invention [0003] Aiming at the above problems, the present invention provides a device for picking up chips with a simple structure and improved work efficiency. [0004] The technical solution of the present invention is: comprising solid crystal arm, follower arm, rotating shaft, stretching frame and stretching frame, [0005...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
Inventor 殷俊陈小华
Owner YANGZHOU YANGJIE ELECTRONIC TECH CO LTD
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