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Radiating component

A technology of heat dissipation components and heat sink groups, which is applied in the direction of electrical components, electric solid-state devices, semiconductor devices, etc., and can solve the problems of damaging the solder feet of the processor and affecting the heat dissipation effect, etc.

Inactive Publication Date: 2013-05-29
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] In order to reduce the heat of electronic components such as chips and processors on the motherboard, a heat sink will be installed, especially the heat dissipation power of the processor is relatively large. In order to effectively reduce the heat generated by the processor, a heat sink is usually fixed on the processor. The base of the cooling device is fixed on the main board by screws to ensure the fit between the processor and the cooling base. Bending, resulting in a gap between the middle of the bottom surface of the base and the processor, which will not only damage the solder pins of the processor, but also affect the heat dissipation effect

Method used

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  • Radiating component
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Embodiment Construction

[0012] see figure 1 and figure 2 In a preferred embodiment of the present invention, the heat dissipation assembly is fixed on a circuit board 100 to dissipate heat from components such as the processor 110 . The heat dissipation assembly includes a radiator 10 and a fixing device 20 . The fixing device 20 fixes the heat sink 10 on the circuit board 100 to dissipate heat from the processor 110 .

[0013] The heat sink 10 includes a substrate 11 and a heat sink set 12 . The substrate 11 is a rectangular plate with a surface 111 . The substrate 11 can cover the processor 110 . The fin assembly 12 is formed by a plurality of fins 121 extending upward from the surface 11 of the substrate 11 and arranged in parallel. A through groove 122 is formed by cutting away the four corners of the end surface of the fin assembly 12 away from the substrate 11 toward the surface 111 of the substrate 11 . The through groove 122 is located at one end of the fin assembly 12 away from the su...

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Abstract

A radiating component is used for radiating heat of elements on a circuit board. The radiating component comprises a radiator and a fixing apparatus. The radiator comprises a substrate and a radiating fin group arranged on the substrate. The fixing apparatus comprises a fixing base, a plurality of clamping arms and locking portions, wherein the plurality of the clamping arms are arranged on the fixing base, and the locking portions are assembled on the clamping arms. The fixing base is sleeved on the periphery of the radiator and fixed with the circuit board. The clamping arms are matched in the radiating fin group to abut the locking portions against the substrate so as to further lock the substrate and the electronic elements.

Description

technical field [0001] The invention relates to a heat dissipation assembly. Background technique [0002] In order to reduce the heat of electronic components such as chips and processors on the motherboard, a heat sink will be installed, especially the heat dissipation power of the processor is relatively large. In order to effectively reduce the heat generated by the processor, a heat sink is usually fixed on the processor. The base of the cooling device is fixed on the main board by screws to ensure the fit between the processor and the cooling base. Bending will cause a gap between the middle of the bottom surface of the base and the processor, which will not only damage the solder pins of the processor, but also affect the heat dissipation effect. Contents of the invention [0003] In view of the above, it is necessary to provide a heat dissipation assembly that will not damage the processor and ensure the heat dissipation effect. [0004] A heat dissipation compon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
CPCH01L23/34H01L2924/0002H01L23/3672H01L23/4006H01L2924/00
Inventor 杨丰旗
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD