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Heat-absorbing material

A technology of heat-absorbing materials and bulk materials, applied in the direction of heat exchange materials, chemical instruments and methods, etc., can solve problems such as too narrow application range, and achieve the effect of effective instantaneous heat peak and simple production and manufacturing

Active Publication Date: 2013-06-12
JONES TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to eliminate the excess heat of short-term overheating of intermittent working equipment, most of the heat absorption schemes in the prior art are made according to the heating components themselves in terms of shape and material selection, and are only suitable for a specific heating component. The scope of application is too narrow

Method used

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Embodiment Construction

[0012] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0013] The heat absorbing material of the present invention includes a carrier and microcapsules containing at least one phase change material, and the microcapsules are evenly distributed in the carrier. The carrier can adopt foam material, solid material, liquid material, paste material and the like. The carrier material can be thermally conductive, such as thermally conductive solid shock-absorbing materials, such as rubber pads in mobile phones; or solid thermally conductive elastic materials, such as thermally conductive gap pads or colloids; or thermally conductive liquid elastomers, such as thermally conductive liquid rubber; Or thermal paste, such as thermal paste or thermal grease. In addition, the carrier mater...

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Abstract

The invention discloses a heat-absorbing material of digital electronic equipment. The heat-absorbing material comprises a carrier and a phase transition microcapsule, wherein the carrier comprises a foam material, a solid material, a liquid material or a paste material; and the phase transition microcapsule has an outer shell and comprises one or more phase transition materials. The phase transition microcapsule is doped in the carrier by the heat-absorbing material provided by the invention; the application of the heat-absorbing material is not restricted by environment and space size; and the heat-absorbing material can be disposed at any position needing heat absorption of the digital electronic equipment. Besides, the heat-absorbing material can perform effective control aiming at the characteristic of instant heat fluctuation of the digital electronic equipment, and has strong practicality.

Description

technical field [0001] The invention relates to a heat-absorbing material, in particular to a heat-absorbing material that can be used in electronic equipment. Background technique [0002] With the continuous updating of digital technology, mobile digital devices based on central processing unit (CPU) and integrated circuit chip (IC), such as mobile phones, notebooks, notebook computers, etc., have increased data calculation speed and improved product integration. Product volume is reduced. These increase the difficulty of dissipating heat from heat-generating components of digital equipment. [0003] Reducing the volume of electronic equipment and increasing heat dissipation capacity are a pair of contradictions, and a reasonable balance needs to be achieved. Especially for mobile phones that work intermittently, designing a heat dissipation solution according to the most extreme heat generation situation will make the design unrealistic and uneconomical. Because most m...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K5/14C09K5/10C09K5/08C09K5/06
Inventor 吴晓宁
Owner JONES TECH
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