Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method and device for simultaneously accessing multiple solid-state disks

A technology of storage location and physical address, applied in the direction of memory address/allocation/relocation, input/output to the record carrier, etc., to achieve the effect of prolonging the service life

Active Publication Date: 2013-06-12
MEMBLAZE TECH BEIJING
View PDF6 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Also, the amount of data carried in the write request may be different from the data capacity of the "step"

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method and device for simultaneously accessing multiple solid-state disks
  • Method and device for simultaneously accessing multiple solid-state disks
  • Method and device for simultaneously accessing multiple solid-state disks

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0073] figure 2 is the data organization of the storage device according to the embodiment of the present invention. The storage device includes a solid state disk 200 , a solid state disk 220 . . . a solid state disk 260 . Each SSD can be a standard size 3.5, 2.5 or 1.8 inch drive. The solid state disk 200 may include a flash memory chip 201 and a flash memory chip 202 . The solid state disk 220 includes a flash memory chip 221 , and the solid state disk 260 includes a flash memory chip 261 . The solid state disk 200 may also include different numbers of flash memory chips. And the solid state disk 200 , the solid state disk 220 and the solid state disk 260 may respectively include different numbers and / or different capacities of flash memory chips. The flash chips in an SSD can be organized into multiple channels to trade off between the number of interface pins used and the parallel access of multiple flash chips. For example, Chinese patent applications with applicat...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention provides a method and a device for accessing multiple drivers of storage equipment. The method comprises the steps of receiving a request of writing first data in a first logical address for the storage equipment, generating a first physical address for the first logical address, generating a write-in command indicating that the first data is written in the first physical address, confirming whether verification data is generated, if so, generating first verification data based on the first data, and writing the first verification data in a second physical address.

Description

technical field [0001] The present invention relates to a solid storage device (Solid Storage Device, SSD), and more specifically, the present invention relates to a method and a device for simultaneously accessing multiple solid state disks. Background technique [0002] Similar to mechanical hard disks, solid-state storage devices are also high-capacity, non-volatile storage devices used in computer systems. Solid-state storage devices generally use flash memory (Flash) as a storage medium. High-performance solid-state storage devices are used in high-performance computers. [0003] The memory target (Target) is one or more logic units (Logic Unit) of the shared chip enable (CE, Chip Enable) signal in the NAND flash package. Each logical unit has a logical unit number (LUN, LogicUnit Number). A NAND flash memory package may include one or more dies. Typically, a logic unit corresponds to a single die. A logical unit can include multiple planes (Plane). Multiple plane...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G06F12/06G06F3/06
Inventor 殷雪冰路向峰
Owner MEMBLAZE TECH BEIJING
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products