Manufacture method for gold finger circuit board and circuit board manufactured by method

Abstract

The invention provides a manufacture method for a gold finger circuit board and the circuit board manufactured by the method. The manufacture method for the gold finger circuit board comprises the steps of offering a base board with a ladder groove, manufacturing a gold finger structure inside the ladder groove, wherein the gold finger structure comprises a gold finger figure and a lead wire connected with the gold finger figure, covering heat resisting solder resisting ink on the surface of the lead wire, coating heat resisting adhesive tape on the surface of the gold finger figure in an attached mode, offering a plurality of plates which are arranged inside the ladder groove in a stack mode, pressing the plurality of plates in a fit mode, milling a top plate corresponding to the adhesive tape in the stacked plates, taking out a sandwich plate clamped between the plate at the top of the plates and the heat resisting adhesive tape, removing the heat resisting adhesive tape covered on the surface of the gold finger figure, electroplating the gold finger figure, forming a gold finger, and obtaining the required gold finger circuit board. The manufacture method can accurately manufacturing the thickness of the required circuit board, can achieve manufacture of the gold finger inside the ladder groove, and is simple in process.

Description

technical field [0001] The invention relates to a circuit board manufacturing method, in particular to a circuit board manufacturing method with stepped grooves and gold fingers arranged in the stepped grooves and a circuit board obtained by the method. Background technique [0002] Gold fingers are composed of golden yellow conductive sheets arranged on the circuit board and arranged in an array, which are used to be plugged into the slot of another component and electrically conductive with another component. Gold fingers are called gold fingers because their surfaces are gold-plated and the conductive sheets are arranged like fingers. The gold finger is actually a layer of gold on the copper clad plate by electroplating or chemical plating. Because the gold finger made by chemical plating is hard, the gold finger is easily broken by external force; the gold finger made by electroplating Fingers do not have the above-mentioned defects, so the industry adopts electroplatin...

AI Technical Summary

Problems solved by technology

However, according to the demand of the market, there is a need to have a circuit board with stepped grooves and gold fingers arranged in the stepped grooves. How to prepare a circuit board that requires golden fingers to be arranged in the stepped grooves? The milling machine with milling function (optical scale control or conductive control) is directly machined and manufactured; by milling the stepped groove, and then performing surface treatment on the bottom of the stepped groove to make gold fingers; however, the depth of this method of controlling the depth of the milling plate cannot be precisely controlled , which is not conducive to the production accuracy requirements of the circuit board

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