Electronic equipment and heat dissipating device thereof
A technology of heat dissipation device and electronic equipment, which is applied in the direction of cooling/ventilation/heating transformation, etc., which can solve the problems of power resource consumption and space occupation, and achieve the effect of improving heat dissipation efficiency
Inactive Publication Date: 2013-06-19
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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Problems solved by technology
The fan not only occupies the space of the chassis, but also consumes a lot of power resources
Method used
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Embodiment Construction
[0013] Please refer to figure 1 , a preferred embodiment of the electronic device of the present invention includes a chassis 100 , a heat dissipation device 200 and a holding member 300 .
[0014] The chassis 100 includes a casing 110 and a circuit board 120 . The casing 110 includes a bottom wall 111, two side walls 112 extending upward from opposite sides of the bottom wall 111, a first end wall 113 connected to one end of the side wall 112, and a first end wall 113 connected to the other end of the side wall 112. The second end wall 114 . The bottom wall 111 , the side wall 112 , the first end wall 113 and the second end wall 114 together define a receiving space 115 . Each of the first and second end walls 113, 114 defines a plurality of ventilation holes. Adjacent to the side wall 112 of the second end wall 114 is defined a mounting groove 117 through the top. A support plate 118 parallel to the bottom wall 111 extends inwardly from the bottom wall of the installatio...
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Provided is a heat dissipating device. The heat dissipating device is used for dissipating heat of a heating element arranged inside a machine case. The heat dissipating device comprises a first heat dissipating device body which is arranged on the heating element, a second heat dissipating device body which is arranged on the outer side of the machine case, and a heat conduction pipe which is connected with the first heat dissipating device body and contacts with the first heat dissipating device body and the machine case. The invention further provides electronic equipment provided with the heat dissipating device. A heat pipe of the heat dissipating device of the electronic equipment is connected with the first heat dissipating device body and the second heat dissipating device body, wherein the first heat dissipating device body and the second heat dissipating device body are respectively arranged inside and outside the machine case, and therefore heat generated by the heating element can be transmitted to the machine case and the second heat dissipating device body through the heat pipe, and heat dissipating efficiency is improved.
Description
technical field [0001] The invention relates to an electronic device and a cooling device thereof. Background technique [0002] A main board and various electronic components (such as a central processing unit, etc.) on the main board are installed in the case of electronic equipment (such as a computer, server). In order to ensure the normal operation of the electronic equipment, a heat sink is generally installed on the top surface of the central processing unit that generates more heat, and a fan is installed on the heat sink, and then the heat is discharged with the assistance of the system fan. However, as the power of the central processing unit continues to increase, the heat dissipation requirement of the central processing unit is also higher and higher, which makes the power of the fan need to be continuously increased to meet the heat dissipation requirement. The fan not only occupies the space of the chassis, but also consumes a lot of power resources. Conten...
Claims
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Inventor 张耀廷詹弘州
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD