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Sheet adhesion device and adhesion method

A technology of sheet materials and supporting devices, applied in the direction of bonding methods, film/sheet-like adhesives, adhesives, etc.

Active Publication Date: 2016-05-25
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is a disadvantage that the adhesive sheet is not adhered to the wafer at the corner between the inner peripheral surface and the bottom surface of the concave portion of the wafer, and a gap is generated between the adhesive sheet and the wafer at this portion.

Method used

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  • Sheet adhesion device and adhesion method
  • Sheet adhesion device and adhesion method
  • Sheet adhesion device and adhesion method

Examples

Experimental program
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Effect test

Embodiment Construction

[0032] Hereinafter, one embodiment of the present invention will be described based on the drawings.

[0033] Such as figure 1 As shown, the sheet sticking apparatus 1 of the present embodiment sticks the mounting sheet MS as an adhesive sheet attached in advance so as to close the opening RF1 of the ring frame RF on the wafer W as an adherend. The wafer W and the ring frame RF are integrated with the mounting sheet MS. Here, the wafer W is ground so that the outer edge is thicker than the other parts, and the ring-shaped convex portion W1 protruding in the thickness direction (back side) is formed on the outer edge portion, and the inner side surrounded by the convex portion W1 is formed. Form the concave portion W2 and on its surface side (the side opposite to the grinding surface, figure 1 A semiconductor wafer on which a circuit is formed on the circuit surface W3 on the lower surface side of the circuit. A protective sheet (not shown) is attached to the circuit surface...

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PUM

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Abstract

A sheet adhesion device and adhesion method. The sheet adhering device (1) of the present invention includes: a sheet supporting device (6, 7), which supports an adhesive sheet (MS) arranged opposite to an adherend (W); a sheet deforming device (8A , 8B), which deflects the supported adhesive sheet (MS) toward the adherend (W) side and adheres to the adherend (W); the deformation limiting device (4A), which has a vertical view of the adherend In (W), the deformation of the adhesive sheet area located outside the outer edge of the adherend to the adherend (W) side is restricted.

Description

technical field [0001] The present invention relates to a sheet adhering device and an adhering method for adhering an adhesive sheet to an adherend. Background technique [0002] At present, in the semiconductor manufacturing process, a sheet adhesive is used in which a protective sheet, a mounting sheet, a dicing tape, a die bonding tape, and other adhesive sheets are attached to the surface of a semiconductor wafer (hereinafter sometimes simply referred to as a wafer) as an adherend. attached device (for example, refer to Patent Document 1). In this sheet adhering device, the annular frame to which the adhesive sheet is adhered is supported on the frame holding part in the chamber, and the wafer is placed on the surface of the adhesive sheet, and the The adhesive sheet is brought into contact with the adhesive sheet to adhere the adhesive sheet to the wafer surface. [0003] On the other hand, there is known a wafer in which the back surface of the wafer is ground in or...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683C09J5/00C09J7/02C09J7/22
CPCH01L21/67132C09J2203/326H01L21/67092C09J7/22C09J7/30C09J7/38C09J5/00H01L21/6835H01L21/6836
Inventor 高野健
Owner LINTEC CORP