Wireless thermal bubble type accelerometer and preparation method thereof

A thermal bubble, accelerometer technology, applied in multi-dimensional acceleration measurement, acceleration measurement using inertial force, etc., can solve problems affecting performance and life, consumption, large energy, etc.

Inactive Publication Date: 2013-07-03
CHUNG HUA UNIVERSITY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Even so, the silicon substrate still dissipates considerable energy from the heater, resulting in a relatively high energy consumption for such hot-bubble accelerometers
Furthermore, the cavi

Method used

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  • Wireless thermal bubble type accelerometer and preparation method thereof
  • Wireless thermal bubble type accelerometer and preparation method thereof
  • Wireless thermal bubble type accelerometer and preparation method thereof

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Embodiment Construction

[0105] On the one hand, the heater and temperature sensing element of the thermal bubble accelerometer disclosed in the present invention are directly attached to the supporting heat-insulating substrate layer instead of being suspended on the groove, so the thermal bubble accelerometer disclosed in the present invention The accelerometer has the advantages of easy fabrication, high yield, more durability, and low manufacturing cost.

[0106] In one aspect, the present invention discloses a method for measuring a thermal bubble accelerometer signal in the vertical axis (Z-axis) using a socket connector to connect the signal to signal processing and wireless circuitry. This connection design is easy to manufacture, install and low cost.

[0107] figure 1 A schematic diagram showing a multi-axial acceleration wireless measurement system 1 according to an embodiment of the present invention is shown. refer to figure 1 As shown, the multi-axial acceleration wireless measuring s...

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Abstract

The invention discloses a wireless thermal bubble type accelerometer and preparation method thereof. The wireless thermal bubble type accelerometer comprises a first insulating substrate, a circuit, a first acceleration sensing device and a first support layer. The circuit is formed on the first insulating substrate. The first acceleration sensing device is coupled with the circuit and comprises two first temperature sensing elements and a first heater between the two first temperature sensing elements. The first support layer is attached to the first insulating substrate and supports the two first temperature sensing elements and the first heater.

Description

technical field [0001] The present invention relates to a thermal bubble accelerometer, in particular to a thermal bubble accelerometer with a non-suspended heater and a temperature sensing element. Background technique [0002] US Patent No. 6,182,509 discloses a Thermal Bubble Accelerometer. The hot-bubble accelerometer includes an insulating substrate, a heater and two temperature sensing elements. The thermal insulation base plate has a groove, the heater and the two temperature sensing elements are suspended on the groove, and the two temperature sensing elements are respectively equidistantly placed on opposite sides of the heater. [0003] To form the suspended heater and two temperature sensing elements, a silicon dioxide layer is first formed on an insulating substrate. Then, a polysilicon layer is formed on the silicon dioxide layer. After that, an oxidation process is performed to form another oxide layer on the polysilicon layer. Next, the polysilicon layer i...

Claims

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Application Information

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IPC IPC(8): G01P15/18
Inventor 林君明
Owner CHUNG HUA UNIVERSITY
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