Unlock instant, AI-driven research and patent intelligence for your innovation.

Wafer dicing method and method of manufacturing light emitting device chips employing the same

A cutting method and a technology of light-emitting devices, which are applied in manufacturing tools, semiconductor devices, semiconductor/solid-state device manufacturing, etc., can solve the problems of increasing overall manufacturing costs and complex semiconductor packaging processes, etc.

Inactive Publication Date: 2013-07-10
SAMSUNG ELECTRONICS CO LTD
View PDF1 Cites 15 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the wafer fabrication process, etch masks are usually formed in a separate photolithography process, which complicates the overall semiconductor packaging process and increases the overall manufacturing cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Wafer dicing method and method of manufacturing light emitting device chips employing the same
  • Wafer dicing method and method of manufacturing light emitting device chips employing the same
  • Wafer dicing method and method of manufacturing light emitting device chips employing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] Certain exemplary embodiments will now be described in more detail with reference to the accompanying drawings.

[0038] In the following description, similar reference numerals are used for similar elements even in different drawings. Matters defined in the specification, such as detailed construction and elements, are provided to assist a thorough understanding of exemplary embodiments. However, exemplary embodiments can be practiced without these specifically limited matters. Also, well-known functions or constructions are not described in detail since they would obscure the application with unnecessary detail.

[0039] A wafer dicing method according to an exemplary embodiment is described in detail below.

[0040] Figures 1A-1F is a schematic diagram illustrating a wafer dicing method according to an exemplary embodiment.

[0041] refer to Figure 1A , a wafer 110 is provided, and semiconductor devices 122 may be formed on the wafer 110 . Wafer 110 may be for...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a wafer dicing method and a method of manufacturing light emitting device chips employing the same. The wafer dicing method includes forming a semiconductor device on a first surface of a wafer; first-dicing a portion of the wafer and the semiconductor device; and splitting the wafer and the semiconductor device into a plurality of semiconductor device chips by second-dicing the wafer that has been first-diced.

Description

technical field [0001] Apparatus and methods consistent with the inventive concepts relate to wafer dicing and fabrication of light emitting device (LED) chips, and more particularly to wafer dicing and methods of fabricating LED chips using the wafer dicing method for performing a first cut on a portion of a wafer , perform additional operations on it, and then perform a second cut of the wafer to form multiple chips. Background technique [0002] In the semiconductor package assembly process, the dicing process is a process for dicing a plurality of semiconductor chips included in a wafer or a process for separating the wafer into individual semiconductor chips so that the individual semiconductor chips can be mounted on on a basic frame, such as a lead frame or a printed circuit board. [0003] The dicing process may be performed using a blade, laser, plasma etching, or the like. Recently, due to improvements in capacity, speed, and miniaturization of semiconductor devi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B28D5/00H01L33/00
CPCH01L33/0095H01L21/78H01L33/005
Inventor 金南胜金维植
Owner SAMSUNG ELECTRONICS CO LTD