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Heat dissipation device and method of mobile terminal, and mobile terminal

A mobile terminal and heat dissipation device technology, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problem of insufficient auxiliary heat dissipation devices, and achieve the effect of lowering the temperature and improving the service life

Active Publication Date: 2013-07-17
HUIZHOU TCL MOBILE COMM CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At the same time, the requirement of communication consumer electronics is thinner, which leads to not enough space to add auxiliary cooling devices

Method used

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  • Heat dissipation device and method of mobile terminal, and mobile terminal
  • Heat dissipation device and method of mobile terminal, and mobile terminal
  • Heat dissipation device and method of mobile terminal, and mobile terminal

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Embodiment Construction

[0022] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0023] The invention provides a heat dissipation device for a mobile terminal, such as figure 1 Shown is a schematic structural view of the first embodiment of the heat dissipation device of the mobile terminal, wherein the heat dissipation device of the mobile terminal includes: a heat dissipation layer 2 attached to the rear shell 1 opposite to the main board 4 of the mobile terminal On the surface, the area where the heat dissipation layer is attached to the surface of the rear case is the same as the area where the main board is orthographically projected on the rear case.

[0024] In the mobi...

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Abstract

The invention discloses a heat dissipation device and a heat dissipation method of a mobile terminal, and the mobile terminal. According to the device, a heat dissipation layer of which the area is equal to that of an orthographic projection region of a motherboard is arranged on the outer surface of a rear shell, which is opposite to the motherboard, and can quickly radiate heat which is emitted by a communication module component near the rear shell in an infrared manner, so that the heat in the mobile terminal can be quickly dissipated. Therefore, the surface temperature of the mobile terminal can be effectively reduced, convenience is provided for a user, and the service life of the mobile terminal is prolonged. The heat dissipation device provided by the invention is particularly applicable to a high-speed mobile terminal.

Description

technical field [0001] The invention belongs to the technical field of mobile terminals, and in particular relates to a heat dissipation device and method for a mobile terminal and the mobile terminal. Background technique [0002] With the development of communication technology, the calorific value of mobile terminals is increasing, which puts forward higher and higher requirements for the thermal design of products. At present, ordinary tablet and mobile phone products are equipped with pluggable 3G / 4G modules. When the mobile terminal contains a 3G / 4G module, the peak current of the PA (power amplifier) ​​part will reach several hundred milliamps, and this module is the main heating element in the mobile terminal. If this happens on a handheld communication device, it will not only bring inconvenience to the user, but its high temperature for a long time will also reduce the service life of the internal components of the mobile terminal. [0003] At the same time, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 吴小伟甘汝云邱盛芳朱丽君
Owner HUIZHOU TCL MOBILE COMM CO LTD
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