Multi-die MEMS package

Abstract

This document refers to multi-die micromechanical system (MEMS) packages. In an example, a multi-die MEMS package can include a controller integrated circuit (IC) configured to couple to a circuit board, a MEMS IC mounted to a first side of the controller IC, a through silicon via extending through the controller IC between the first side and a second side of the controller IC, the second side opposite the first side, and wherein the MEMS IC is coupled to the through silicon via.

Description

[0001] claim priority [0002] This application claims to enjoy U.S. Provisional Patent Application No.61 / 384,241 (Proxy No.: 2921.096PRV) and U.S. Provisional Patent Application No. 61 / 384,321 filed on September 20, 2010 entitled "Integrated Inertial Sensor (Integrated Inertial Sensor)" (Attorney Docket No.: 2921.0105 PRV), each of which is incorporated herein by reference in its entirety. Background technique [0003] Broadly speaking, applications using multiple microelectromechanical systems (MEMS) chips include separate controllers for each MEMS chip. For example, an inertial sensor may be packaged with its own application specific integrated circuit (ASIC), while a pressure sensor is packaged with a separate ASIC. Since each additional MEMS chip includes an associated controller or controller circuitry, multiple MEMS systems can reduce the total amount of power consumed, the silicon and real estate used, the engineering The cost of resources and production systems inc...

AI Technical Summary

Problems solved by technology

High voltage ASICs can be manufactured, however they are expensive and not fully standardized

MEMS requiring high voltages get stuck with expensive ASICs, increasing cost to levels that cannot support many user applications

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