Bilateral driving type annular guide rail chip transmission device

Abstract

The invention discloses a bilateral driving type annular guide rail chip transmission device which comprises a base, a synchronous transmission mechanism, an annular guide rail sliding mechanism and a material carrying mechanism, wherein the synchronous transmission mechanism, the annular guide rail sliding mechanism and the material carrying mechanism are arranged on the base. The synchronous transmission mechanism adopts an upper transmission mechanism and a lower transmission mechanism for synchronous driving, wherein the upper transmission mechanism is formed by an upper driving synchronous pulley, an upper driven synchronous pulley and an upper synchronous driving belt, and the lower transmission mechanism is formed by a lower driving synchronous pulley, a lower driven synchronous pulley and a lower synchronous driving belt. The annular guide rail sliding mechanism comprises a guide rail support arranged between the upper synchronous transmission belt and the lower synchronous transmission belt, an annular guide rail installed on the guide rail support and a plurality of sliders in sliding match with the annular guide rail. The material carrying mechanism comprises a material carrying block fixed on the sliders and used for carrying materials, two ends of the material carrying block are respectively connected onto the upper transmission mechanism and the lower transmission mechanism. The bilateral driving type annular guide rail chip transmission device is simple in structure, small in mechanical vibration and accurate and smooth in transmission.

Description

technical field [0001] The invention relates to a material conveying device, in particular to a double-sided drive ring guide rail chip conveying device used for conveying chips in integrated circuit packaging equipment. Background technique [0002] In the automatic production line, the material transmission device connects the various stations in the production line and acts as a bridge. Nowadays, with the continuous development of integrated circuit manufacturing technology, the automatic production line of integrated circuit manufacturing is developing in the direction of high speed, high precision and high reliability. Since the operation object of the integrated circuit manufacturing line is a chip with a very small feature size, strict requirements are placed on the vibration, fast smoothness and precise emergency stop during the transmission device. In the existing material conveying devices of integrated circuit packaging equipment, belt transportation, chain plate...

AI Technical Summary

Problems solved by technology

However, due to the unilateral traction of the slider in this transmission mode, the angle between the slider and the guide rail is easy to form, thus increasing the resistance of the transmission and the mechanical vibration during the transmission process; The end face, the inner face and the outer face are used as the working faces. When the slider runs on the arc segment of the ring guide rail, there are two line contacts between the three working faces of the slider and the three working faces of the ring guide rail, further increasing the Mechanical vibration is reduced, and the stability of material transmission is reduced, so it cannot meet the material transmission requirements of integrated circuit packaging production lines.

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