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Heat exchange system and method for high-temperature semiconductor process equipment

A heat exchange system and semiconductor technology, applied in heat exchange equipment, heat exchanger types, indirect heat exchangers, etc., can solve problems such as failure to meet semiconductor process requirements, unstable air temperature, and impurities in wafers

Active Publication Date: 2015-10-21
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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AI Technical Summary

Problems solved by technology

[0002] In the existing technology, in the high-temperature semiconductor processing process, it is necessary to perform heat exchange treatment on the circulating air to achieve cooling of the hot air. However, when using a heat exchanger for heat exchange treatment, once the heat exchanger itself appears Inefficiency and errors will make the air temperature obtained by heat exchange treatment unstable or fail to meet the semiconductor process requirements, which will make the wafer doped with impurities
This inefficiency may be due to blockage of water flow in the exchanger, or it may be due to inefficient degradation of the function of the exchanger itself

Method used

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  • Heat exchange system and method for high-temperature semiconductor process equipment
  • Heat exchange system and method for high-temperature semiconductor process equipment

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Embodiment Construction

[0020] The following will combine figure 1 with figure 2 With a detailed description of the heat exchange system and method of the high-temperature semiconductor process equipment provided by the present invention, it can be considered that those skilled in the art can modify and polish it within the scope of not changing the spirit and content of the present invention.

[0021] Please refer to figure 1 , this embodiment provides a heat exchange system for a high-temperature semiconductor process machine, which is used to connect with the two ventilation ports 202 of the reaction chamber 200, including the air inlet 101, the air outlet 102, the heat exchanger 104, and the The blower 103 of air outlet 102 and a thermal sensor 105, please refer to figure 1 In the air flow direction 106, after the hot air discharged from the reaction chamber 200 enters the air inlet 101, it passes through the heat exchanger 104, the thermal sensor 105 and the air outlet 102 in sequence, and th...

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Abstract

The invention provides a heat exchange system and a heat exchange method for a machine with high-temperature semiconductor process. The heat exchange system is connected with two ventilation ports of a reaction chamber of the machine and comprises an air inlet, an air outlet, a heat exchanger, a blower at the air outlet and a heat sensor. Hot air discharged from the reaction chamber enters the air inlet, sequentially passes through the heat exchanger, the heat sensor and the air outlet, and is driven into the reaction chamber by the blower at the air outlet. The heat exchanger is used for cooling the hot air. The heat sensor is used for acquiring the temperature of the air cooled by the heat exchanger. When the acquired temperature of the cooled air is higher than a preset value, heat exchange is stopped. By the heat sensor, errors and inefficiency, which influence semiconductor process, of heat exchange are avoided.

Description

technical field [0001] The invention relates to the field of semiconductor technology, in particular to a heat exchange system and method for a high-temperature semiconductor technology machine. Background technique [0002] In the existing technology, in the high-temperature semiconductor processing process, it is necessary to perform heat exchange treatment on the circulating air to achieve cooling of the hot air. However, when using a heat exchanger for heat exchange treatment, once the heat exchanger itself appears Inefficiency and errors will make the air temperature obtained by the heat exchange process unstable or fail to meet the semiconductor process requirements, which in turn will make the wafer doped with impurities. This inefficiency may be due to blockage of water flow in the exchanger, or it may be an inefficient degradation of the function of the exchanger itself. Contents of the invention [0003] The technical problem to be solved by the invention is how...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28D1/00F28F27/00
Inventor 傅荣颢黄锦才
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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