Heat exchange system and method for high-temperature semiconductor process equipment
A heat exchange system and semiconductor technology, applied in heat exchange equipment, heat exchanger types, indirect heat exchangers, etc., can solve problems such as failure to meet semiconductor process requirements, unstable air temperature, and impurities in wafers
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Publication Date
- 2015-10-21
Smart Images
Figure 1 Figure 2
Abstract
Description
technical field
[0001] The invention relates to the field of semiconductor technology, in particular to a heat exchange system and method for a high-temperature semiconductor technology machine. Background technique
[0002] In the existing technology, in the high-temperature semiconductor processing process, it is necessary to perform heat exchange treatment on the circulating air to achieve cooling of the hot air. However, when using a heat exchanger for heat exchange treatment, once the heat exchanger itself appears Inefficiency and errors will make the air temperature obtained by the heat exchange process unstable or fail to meet the semiconductor process requirements, which in turn will make the wafer doped with impurities. This inefficiency may be due to blockage of water flow in the exchanger, or it may be an inefficient degradation of the function of the exchanger itself. Contents of the invention
[0003] The technical problem to be solved by the invention is how...
Examples
Embodiment Construction
[0020] The following will combine figure 1 with figure 2 With a detailed description of the heat exchange system and method of the high-temperature semiconductor process equipment provided by the present invention, it can be considered that those skilled in the art can modify and polish it within the scope of not changing the spirit and content of the present invention.
[0021] Please refer to figure 1 , this embodiment provides a heat exchange system for a high-temperature semiconductor process machine, which is used to connect with the two ventilation ports 202 of the reaction chamber 200, including the air inlet 101, the air outlet 102, the heat exchanger 104, and the The blower 103 of air outlet 102 and a thermal sensor 105, please refer to figure 1 In the air flow direction 106, after the hot air discharged from the reaction chamber 200 enters the air inlet 101, it passes through the heat exchanger 104, the thermal sensor 105 and the air outlet 102 in sequence, and th...