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Shielding insertion mechanism and semiconductor package with integrated electromagnetic shielding body

An insertion mechanism and electromagnetic shielding technology, which is applied in the field of semiconductor packaging of electromagnetic shielding objects, can solve problems such as aggravating unwanted noise

Active Publication Date: 2013-09-11
AVAGO TECH INT SALES PTE LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The problem of inducing unwanted noise is exacerbated by the shrinking size of semiconductor packages and the reduced separation between adjacent dies and when more than two dies are packaged in the same package

Method used

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  • Shielding insertion mechanism and semiconductor package with integrated electromagnetic shielding body
  • Shielding insertion mechanism and semiconductor package with integrated electromagnetic shielding body
  • Shielding insertion mechanism and semiconductor package with integrated electromagnetic shielding body

Examples

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Embodiment Construction

[0042] The following description contains specific information pertaining to embodiments of the invention. Those skilled in the art will appreciate that the present invention may be practiced otherwise than as specifically discussed herein. The drawings in this application and their accompanying detailed description are for exemplary embodiments only. Similar or corresponding elements in these figures may be designated by similar or corresponding reference numerals, unless otherwise stated. Furthermore, the drawings and descriptions in this application are generally not to scale and are not intended to correspond to actual relative dimensions.

[0043] figure 1 A cross-sectional view of one example of a semiconductor package fabricated using known techniques is shown. Such as figure 1 As shown in , the semiconductor package 100 includes a top active die 110 and a bottom active die 130 . The top active die 110 includes a dielectric layer 116 on a substrate 118 . Top activ...

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Abstract

The invention relates to a shielding insertion mechanism and a semiconductor package with an integrated electromagnetic shielding body. The invention discloses various embodiments of a shielding insertion mechanism that is arranged between a top active tube core and a bottom active tube core and is used for shielding the active tube cores to avoid electromagnetic noises. According to one embodiment, the shielding insertion mechanism comprises an insertion mechanism dielectric layer, through-silicon-vias (TSV) arranged inside the insertion mechanism dielectric layer and an electromagnetic shielding body. The TSVs enable the electromagnetic shielding body to be connected to a first fixed potential; and the electromagnetic shielding body can include conducting layers gratings that are extended transversely and cross through the shielding insertion mechanism. Besides, the shielding insertion mechanism can also include another electromagnetic shielding body. In addition, disclosed in the invention is a semiconductor package with an integrated electromagnetic shielding body.

Description

technical field [0001] The present invention generally relates to the field of semiconductors, and in particular to a shield insertion mechanism for shielding an active die from electromagnetic noise and a semiconductor package with an integrated electromagnetic shield. Background technique [0002] There is a growing need to reduce the size of semiconductor packages while enhancing functionality. This need typically results in semiconductor packages being designed to accommodate more than one semiconductor die, where each die may be a composite die containing numerous transistors and multilayer interconnections. During operation, the composite die generates substantial transient currents that flow through the various interconnections on the die. The large amount of transient current and the accompanying transient voltage in turn results in a large amount of electromagnetic noise generated by each die. Since advanced packages include multiple dies in close proximity, elect...

Claims

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Application Information

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IPC IPC(8): H01L23/552H01L23/31
CPCH01L23/147H01L23/481H01L23/50H01L23/5225H01L23/5286H01L23/552H01L25/0657H01L2224/02372H01L2224/0401H01L2224/13025H01L2224/16145H01L2224/16146H01L2224/16225H01L2224/16235H01L2224/17181H01L2225/06513H01L2225/06517H01L2225/06537H01L2225/06541H01L2225/06565H01L2924/15311H01L2924/15321H01L2924/19107H01L2924/3025H01L23/48H01L23/60H05K9/00
Inventor 桑帕施·K·V·卡里卡兰胡坤忠赵子群雷佐尔·拉赫曼·卡恩彼得·沃伦坎普陈向东
Owner AVAGO TECH INT SALES PTE LTD
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