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Method for manufacturing rigid-flexible circuit board

A technology of combination of soft and hard, and a production method, which is applied in the direction of assembling printed circuits with electric components, can solve the problems that the hard circuit board and the flexible circuit board cannot be electrically connected, and cannot meet the miniaturization of the soft and hard circuit board, so as to achieve The effect of electrical conduction

Active Publication Date: 2013-09-18
QING DING PRECISION ELECTRONICS HUAIAN CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this way, there is no electrical conduction between the rigid circuit board and the flexible circuit board of the obtained rigid-flex circuit board, which cannot meet the miniaturization requirements of the rigid-flex circuit board.

Method used

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  • Method for manufacturing rigid-flexible circuit board
  • Method for manufacturing rigid-flexible circuit board
  • Method for manufacturing rigid-flexible circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] The manufacturing method of the soft-rigid circuit board provided by the technical solution includes the following steps:

[0020] For a first step, see figure 1 , providing a flexible circuit board 110 .

[0021] The flexible circuit board 110 is a circuit board fabricated with conductive circuits. The flexible circuit board 110 can be a single-sided circuit board or a double-sided circuit board. In this embodiment, the flexible printed circuit board 110 is taken as an example for illustration. The flexible circuit board 110 includes a first insulating layer 111 , a first conductive circuit 112 , a second conductive circuit 113 and a cover film 116 . The first insulating layer 111 includes an opposite first surface 1111 and a second surface 1112, the first conductive circuit 112 is formed on the first surface 1111 of the first insulating layer 111, and the second conductive circuit 113 is formed on the first surface 1111 of the first insulating layer 111. Two surfa...

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Abstract

Provided is a method for manufacturing a rigid-flexible circuit board. The method includes the following steps of: providing a flexible circuit board having a first conductive circuit and including a bent area and a fixed area; providing a rigid circuit board, wherein a first opening corresponding to the bent area is arranged inside the rigid circuit board, the rigid circuit board is provided with a third conductive circuit corresponding to the first conductive circuit, and a metal bump is formed on the third conductive circuit; providing a first adhesive piece, a second adhesive piece and copper foils, wherein a third opening corresponding to the bent area is formed inside the first adhesive piece; sequentially stacking and pressing the copper foils, the second adhesive piece, the rigid circuit board, the first adhesive piece and the flexible circuit board, wherein the first opening and the third opening are mutually communicated, and the metal bump and the first conductive circuit on the surface of the flexible circuit board are mutually and electrically communicated; manufacturing the copper foil corresponding to the fixed area into an outer-layer circuit; and removing the copper foil corresponding to the bent area and the second adhesive piece to obtain the rigid-flexible circuit board.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a method for producing a circuit board with a groove structure. Background technique [0002] Printed circuit boards have been widely used due to their advantages such as high assembly density. For the application of the circuit board, please refer to the literature Takahashi, A. Ooki, N. Nagai, A. Akahoshi, H. Mukoh, A. Wajima, M. Res. Lab, High density multilayer printed circuit board for HITAC M-880, IEEE Trans . on Components, Packaging, and Manufacturing Technology, 1992, 15(4): 1418-1425. [0003] Rigid-flex circuit board is a circuit board structure including interconnected flexible boards and rigid boards, which can not only have the flexibility of flexible circuit boards, but also include the hardness of rigid circuit boards. In the production process of the flexible and rigid circuit board, the flexible circuit board and the rigid circuit board are usually comb...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36
Inventor 邝浩文豪顿哈普
Owner QING DING PRECISION ELECTRONICS HUAIAN CO LTD
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