Image sensor module with reduced overall thickness

[0051] Example one

[0052] See Figure 2A to Figure 2D As shown, Figure 2A Is the top view of the flexible substrate before being bent, Figure 2B for Figure 2A 2B-2B cross-sectional schematic diagram, Figure 2C Is a schematic side view of the flexible substrate before being bent, Figure 2D It is a schematic side view of the flexible substrate after being bent. As can be seen from the above figures, the first embodiment of the present invention provides an image sensor module Z with reduced overall thickness, which includes: a substrate unit 1, a transparent unit 2, an image sensor unit 3 and a lens unit 4.

[0053] First, cooperate Figure 2A versus Figure 2B As shown, the substrate unit 1 includes at least one flexible substrate 10, wherein the flexible substrate 10 has at least one through opening 100. The light transmitting unit 2 includes at least one light transmitting element 20 disposed on the upper surface of the flexible substrate 10 and corresponding to the through opening 100. The image sensing unit 3 includes at least one image sensing element 30 disposed on the lower surface of the light-transmitting element 20 and embedded in the through opening 100, wherein the image sensing element 30 is electrically connected to the flexible substrate 10. The lens unit 4 includes an opaque frame 40 disposed on the upper surface of the flexible substrate 10 and surrounding the light-transmitting element 20 and a lens 41 connected to the opaque frame 40 and positioned above the light-transmitting element 20. For example, the flexible substrate 10 can be a circuit substrate that can be bent arbitrarily. The light-transmitting element 20 can be made of any material with light-transmitting or transparent effect, such as glass. The image sensor element 30 can be an image sensor with an image capturing function, such as a Complementary Metal-Oxide-Semiconductor (CMOS) image sensor, and the lower surface of the flexible substrate 10 and the image sensor element The lower surface of 30 may be flush. However, the flexible substrate 10, the light-transmitting element 20, and the image sensing element 30 defined by the present invention are not limited to the example cited in the first embodiment.

[0054] For example, with Figure 2A , Figure 2C versus 2D As shown, when the flexible substrate 10 is not bent (such as Figure 2A versus Figure 2C (Shown), the flexible substrate 10 has a main body portion 10A and at least two extension portions 10B respectively extending outwardly from opposite side ends of the main body portion 10A in parallel. When the flexible substrate 10 is along Figure 2A After the two bending lines L shown are bent (such as Figure 2D (Shown), the flexible substrate 10 has a main body portion 10A and at least two extension portions 10B respectively extending upward from two opposite side ends of the main body portion 10A, and the at least two extension portions 10B are respectively adjacent to the lens Two opposite side ends of unit 4. Since the above-mentioned at least two extension parts 10B have an electromagnetic shielding effect, the present invention can reduce electromagnetic interference through the design of the above-mentioned at least two extension parts 10B. In addition, such as Figure 2A As shown, the substrate unit 1 further includes a plurality of electronic components 11 disposed on the flexible substrate 10, and any two of the above-mentioned plurality of electronic components 11 can pass through a "only" second disposed on the main body 10A. A conductive circuit W1 is electrically connected to each other. However, the substrate unit 1 defined by the present invention is not limited to the example cited in the first embodiment.

[0055] In addition, cooperate Figure 2A versus Figure 2B As shown, the image sensor module Z further includes: a conductive unit 5, which includes a plurality of first conductive bodies 51 arranged between the light-transmitting element 20 and the flexible substrate 10 and a plurality of first conductive bodies 51 arranged on the light-transmitting element 20 The second conductive body 52 between the image sensor element 30 and the first conductive body 51 and the second conductive body 52 can be solder balls or solder paste with conductive functions. Furthermore, the upper surface of the flexible substrate 10 has at least one first conductive circuit W1, and the lower surface of the light-transmitting element 20 has at least one corresponding first conductive body 51 to be electrically connected to the first conductive circuit. The second conductive circuit W2 of W1, and the upper surface of the image sensor element 30 has at least one third conductive circuit W3 electrically connected to the second conductive circuit W2 through one of the corresponding second conductive bodies 52. Therefore, the image sensor element 30 can sequentially pass through the third conductive circuit W3, the corresponding second conductive body 52, the second conductive circuit W2, the corresponding first conductive body 51, and the first conductive circuit W1 to electrically It is connected to the flexible substrate 10. Of course, the present invention can also replace the first conductive body 51 and the second conductive body 52 with a first conductive circuit W1 connected to the flexible substrate 10, a second conductive circuit W2 of the light-transmitting element 20, and the image sensing element 30. The conductive material (not shown) between the three third conductive lines W3 or a first conductive line W1 connected to the flexible substrate 10 and the third conductive line W3 of the image sensor element 30, so The image sensor element 30 can also pass through the third conductive circuit W3, the aforementioned conductive material (not shown) between the flexible substrate 10, the light-transmitting element 20, and the image sensor element 30 more directly in sequence. The first conductive circuit W1 is electrically connected to the flexible substrate 10. In other words, any method for electrically connecting the image sensor 30 to the flexible substrate 10 can be applied to the present invention. Therefore, the conductive unit 5 defined in the present invention is not limited to the example cited in the first embodiment.

[0056] Furthermore, cooperate Figure 2A versus Figure 2B As shown, the image sensor module Z may further include: a connection unit 6 including a plurality of connection elements 60 disposed between the light-transmitting element 20 and the image sensor element 30, so that the image sensor element 30 can be further It is firmly fixed on the lower surface of the light-transmitting element 20. For example, the connecting element 60 can be any viscous material with viscosity. Of course, the multiple connecting elements 60 described above can also be replaced with a single connecting element 60 presenting a surrounding shape. Therefore, the connecting unit 6 defined by the present invention is not limited to the example cited in the first embodiment.

[0057] Example two

[0058] See image 3 As shown, the second embodiment of the present invention provides an image sensing module Z with reduced overall thickness, which includes: a substrate unit 1, a light transmitting unit (not shown), an image sensing unit (not shown), and A lens unit 4. by image 3 versus Figure 2A The comparison shows that the biggest difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the substrate unit 1 includes a plurality of electronic components 11 arranged on a flexible substrate 10, and the above-mentioned plurality of electronic components 11 Two of them can be electrically connected to each other through a first conductive circuit W1 disposed on the main body portion 10A and one of the extension portions 10B "simultaneously". In other words, any two of the plurality of electronic components 11 of the present invention can selectively pass through (1) "One and only the first conductive circuit W1 (such as Figure 2A The illustrated embodiment 1)" or (2)"-the first conductive circuit W1 (e.g., on the main body portion 10A and one of the extension portions 10B) image 3 The shown embodiment 2) is one of the two ways to achieve the purpose of electrically connecting with each other.

[0059] Example three

[0060] See Figure 4 As shown, the third embodiment of the present invention provides an image sensor module Z with a reduced overall thickness, which includes: a substrate unit 1, a light-transmitting unit 2, an image sensor unit 3, and a lens unit 4. The substrate unit 1 includes at least one flexible substrate 10, wherein the flexible substrate 10 has at least one through opening 100. The light transmitting unit 2 includes at least one light transmitting element 20 disposed on the upper surface of the flexible substrate 10 and corresponding to the through opening 100. The image sensing unit 3 includes at least one image sensing element 30 disposed on the lower surface of the light-transmitting element 20 and embedded in the through opening 100, wherein the image sensing element 30 is electrically connected to the flexible substrate 10. The lens unit 4 includes an opaque frame 40 disposed on the upper surface of the flexible substrate 10 and surrounding the light-transmitting element 20 and a lens 41 connected to the opaque frame 40 and positioned above the light-transmitting element 20.

[0061] by Figure 4 versus Figure 2B The comparison shows that the biggest difference between the third embodiment of the present invention and the first embodiment is that in the third embodiment, the bottom surface of the flexible substrate 10 and the bottom surface of the image sensing element 30 may be non-level. For example, since the upper surface of the image sensor element 30 protrudes from the through opening 100 (that is, if the lower surface of the flexible substrate 10 is used as the reference surface, the upper surface of the image sensor element 30 is high On the upper surface of the flexible substrate 10), so the lower surface of the image sensor element 30 is shrunk and placed in the through opening 100 (that is, the upper surface of the flexible substrate 10 is used as the reference plane If so, the lower surface of the image sensor element 30 is lower than the lower surface of the flexible substrate 10). Therefore, when the image sensor module Z is installed on any additional circuit board (not shown), the image sensor element 30 can be completely enclosed.