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Image sensor module with reduced overall thickness

An image sensing and image sensing element technology, applied in the field of image sensing modules, can solve the problems of reducing the overall thickness, the overall thickness cannot be effectively reduced, etc., and achieve the effect of reducing the overall thickness

Active Publication Date: 2015-10-14
ANHUI HAIHUA CHEM
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides an image sensing module with reduced overall thickness, which can effectively solve the defect that the overall thickness of the known image sensing module using anti-electromagnetic interference components cannot be effectively reduced

Method used

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  • Image sensor module with reduced overall thickness
  • Image sensor module with reduced overall thickness
  • Image sensor module with reduced overall thickness

Examples

Experimental program
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Embodiment 1

[0052] see Figure 2A to Figure 2D as shown, Figure 2A is a schematic top view of the flexible substrate before it is bent, Figure 2B for Figure 2A The schematic cross-section of 2B-2B, Figure 2C is a schematic side view of the flexible substrate before being bent, Figure 2D It is a schematic side view of the flexible substrate after being bent. It can be seen from the above figures that Embodiment 1 of the present invention provides an image sensing module Z with reduced overall thickness, which includes: a substrate unit 1 , a light-transmitting unit 2 , an image sensing unit 3 and a lens unit 4 .

[0053] First, cooperate Figure 2A and Figure 2B As shown, the substrate unit 1 includes at least one flexible substrate 10 , wherein the flexible substrate 10 has at least one through opening 100 . The light transmission unit 2 includes at least one light transmission element 20 disposed on the upper surface of the flexible substrate 10 and corresponding to the thro...

Embodiment 2

[0058] see image 3 As shown, Embodiment 2 of the present invention provides an image sensing module Z with reduced overall thickness, which includes: a substrate unit 1, a light-transmitting unit (not shown in the figure), an image sensing unit (not shown in the figure) and A lens unit 4 . Depend on image 3 and Figure 2A It can be seen from the comparison that the biggest difference between the second embodiment of the present invention and the first embodiment is: in the second embodiment, the substrate unit 1 includes a plurality of electronic components 11 arranged on the flexible substrate 10, and the plurality of electronic components 11 Two of them can be electrically connected to each other through a first conductive circuit W1 provided "simultaneously" on the main body 10A and one of the extension parts 10B. In other words, any two of the plurality of electronic components 11 of the present invention can be selectively passed through (1) "a first conductive line ...

Embodiment 3

[0060] see Figure 4 As shown, the third embodiment of the present invention provides an image sensing module Z with reduced overall thickness, which includes: a substrate unit 1 , a light transmission unit 2 , an image sensing unit 3 and a lens unit 4 . The substrate unit 1 includes at least one flexible substrate 10 , wherein the flexible substrate 10 has at least one through opening 100 . The light transmission unit 2 includes at least one light transmission element 20 disposed on the upper surface of the flexible substrate 10 and corresponding to the through opening 100 . The image sensing unit 3 includes at least one image sensing element 30 disposed on the lower surface of the transparent element 20 and embedded in the through opening 100 , wherein the image sensing element 30 is electrically connected to the flexible substrate 10 . The lens unit 4 includes an opaque frame 40 disposed on the upper surface of the flexible substrate 10 and surrounding the transparent elem...

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Abstract

The invention provides an image sensing module with reduced overall thickness. The image sensing module with reduced overall thickness comprises a substrate unit, a light transmission unit, an image sensing unit and a lens unit, wherein the substrate unit comprises a flexible substrate with at least one through opening; the light transmission unit comprises a light transmission element disposed on the upper surface of the flexible substrate and corresponding to the through opening; the image sensing unit comprises an image sensing element disposed on the lower surface of the light transmission unit and embedded into the through opening, and the image sensing unit is connected to the flexible substrate electrically; and the lens unit comprises an opaque frame disposed on the upper surface of the flexible substrate and surrounding the light transmission element, and a lens connected with the opaque frame and fixed above the light transmission element. Therefore, by adopting the design of embedding the image sensing element into the through opening, the integral thickness of the image sensing module is reduced effectively.

Description

technical field [0001] The invention relates to an image sensing module, in particular to an image sensing module with reduced overall thickness. Background technique [0002] In terms of traditional known technologies, the special niche of the Complementary Metal-Oxide-Semiconductor (CMOS) image sensor lies in the characteristics of "low power consumption" and "small size", so the CMOS image sensor is easy to integrate into Portable electronic products with special needs, such as mobile phones and notebook computers with small integration space. [0003] see Figure 1A to Figure 1C as shown, Figure 1A is a schematic top view of a known image sensing module, Figure 1B is a schematic front view of a known image sensing module, Figure 1C for Figure 1B The 1C-1C cross-sectional schematic diagram. by the above Figure 1A-Figure 1C It can be seen from the above that an image sensing module provided by the known technology includes: a hard substrate 1a, an image sensor 2...

Claims

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Application Information

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IPC IPC(8): H01L27/146
Inventor 许志行
Owner ANHUI HAIHUA CHEM
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