A method for etching the outer layer of a pcb board with fine lines
An outer layer circuit and PCB board technology, which is applied in the field of outer layer circuit etching of PCB boards of fine lines, can solve the problems of thin lines and dirty etching, so as to avoid dirty etching, good etching effect and reduce side erosion. Effect
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[0016] In order to illustrate the idea and purpose of the present invention, the present invention will be further described below in conjunction with specific embodiments.
[0017] The invention provides a method for etching the outer layer of a PCB board with a fine line, which is mainly used to solve the current problem of etching the outer layer of a PCB board with a line width of ≤0.10mm and a line gap of ≤0.10mm due to the first stage of etching. The spray pressure is relatively high, and a fixed spray pressure is used, but it is easy to have the problem of "burrs" or slight etching of the smallest or individual lines, and the local dense lines.
[0018] Wherein the present invention mainly comprises steps as follows:
[0019] S1. Stick a dry film on the copper-clad board after the copper-plated hole, and cover the film picture on the dry film, and perform exposure and development;
[0020] According to the requirements, correspondingly design the film picture correspon...
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