Automatic quantitative adding system

An automatic feeding and automatic technology, applied in the direction of cells, electrolysis process, electrolysis components, etc., can solve the problems of low adding precision, easy fatigue of components, and difficult adjustment, so as to meet the production process, ensure the quality of electroplating, and improve production efficiency. Effect

Active Publication Date: 2013-10-02
KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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  • Abstract
  • Description
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  • Application Information

AI Technical Summary

Problems solved by technology

The disadvantage of this method is that the flow output of the metering pump is unstable, and the same amount of feeding cannot be guaranteed each time, and the addition accuracy is low, which affects the quality of electroplating.
At the same time, the parts of the metering pump are prone to fatigue after long-term work, which will cause wear and tear of the parts, reduce sensitivity, change the flow accuracy, and make adjustment difficult, which will affect the amount of additives added and the needs of the production process.

Method used

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Embodiment Construction

[0020] The present invention will be further elaborated below by specific examples.

[0021] refer to figure 1 , an automatic quantitative addition system in this embodiment, including an electroplating auxiliary cylinder 1, a PLC controller (programmable controller) 2, a timer 3, an automatic feeding pump 6, a quantitative cup 5 and an additive storage tank 4, the The PLC controller 2 is respectively connected with the automatic feeding pump 6, the timer 3 and the quantitative cup 5 through the lines, and the quantitative cup 5 is respectively connected with the electroplating auxiliary cylinder 1, the auxiliary agent storage tank 4 and the automatic feeding pump 6 through the pipelines, The automatic feeding pump 6 is connected with the auxiliary agent storage tank 4 through pipelines.

[0022] refer to figure 2 , the quantitative cup includes a cup body 101, and a baffle plate 102 is arranged in the cup body, and the baffle plate 102 divides the cup body into a feed area...

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Abstract

The invention provides an automatic quantitative adding system. The system comprises an electroplating auxiliary cylinder, a PLC controller, a timer, an automatic charging pump, an quantitative cup and an assistant storage tank, the PLC controller is connected with the automatic charging pump, the timer and the quantitative cup through a line respectively, the quantitative cup is connected with the electroplating auxiliary cylinder, the assistant storage tank and the automatic charging pump through a pipeline respectively, and the automatic charging pump is connected with the assistant storage tank through a pipeline. The system has the advantages of realization of the quantitative addition of an assistant, guarantee of the same charging amount each time, high adding precision, electroplating quality guarantee, adjusting convenience, good stability, production technology satisfying, and production efficiency increase.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing equipment, in particular to an automatic quantitative addition system for electroplating auxiliary agents. Background technique [0002] In the electroplating process of printed circuit boards, the additive is a very small amount of substance in the electroplating solution, but it can greatly change the properties of the coating such as appearance quality and physical quality. [0003] The common and more accurate way of adding electroplating additives is to control the flow rate and adding time of the metering pump. The metering pump uses the working principle of the motor to push the isolation diaphragm, and the sealed pump head moves back and forth to effectively cooperate with the monolithic valve. to achieve fluid flow. The disadvantage of this method is that the flow output of the metering pump is not stable, it cannot guarantee the same feeding amount each time,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/14
Inventor 梁炳源崔京京
Owner KALEX MULTI LAYER CIRCUIT BOARD (ZHONGSHAN) CO LTD
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