A method of manufacturing a 77ghz high-precision radio frequency radar printed circuit board

Abstract

Disclosed in the present invention is a manufacturing method for a 77 GHz high-precision radio frequency radar printed circuit board, mainly comprising: design of circuit gain compensation; selection of mode of acidic etching; design for optimizing preservation of right-angles at the corners of rectangular pads and copperless areas; design for optimizing the frame used for electroplating the board; other conventional steps in the manufacturing process. In the present invention, the manufacturing method for a 77 GHz high-precision radio frequency radar printed circuit board has advantages such as: high-precision pattern etching; small burr size; preservation of right angles at the corners of rectangular pads and copperless areas; reduced cost; high machining efficiency; and a high yield rate.

Description

technical field [0001] The invention relates to the technical field of manufacturing an automobile radio frequency radar board, in particular to a method for manufacturing a 77Ghz high-precision radio frequency radar printed circuit board. Background technique [0002] The space wave with a frequency of 30-300Ghz is called millimeter wave, which is mainly used in road identification of vehicles and high-voltage line identification of helicopters. The operating frequency bands of automotive millimeter-wave radars are 21.65-26.65Ghz and 76-87Ghz. The more common operating frequencies of automotive millimeter-wave radars are 24Ghz, 77Ghz, and 79Ghz. The application of millimeter-wave radar ranging in automobiles has the characteristics of stable detection performance and good environmental adaptability, because millimeter-wave radar is not easily affected by the shape and color of the object's surface, and is not affected by atmospheric air flow. The impact of rain, snow and fo...

AI Technical Summary

Problems solved by technology

At the same time, the RF radar printed circuit board is made of PTFE+ceramic filler plate. The plate is thin (100-150um) and soft, and the following problems are prone to occur in the processing process: 1. The existing line compensation and etching processing methods cannot effectively guarantee the pattern welding. The pad and the corner are at right angles. Due to the flow effect of the etching potion, the four right-angle positions of the pad are easy to etch due to the exchange of etching potion, and become an ellipse of the pad; and the corners of the graphics are difficult to exchange due to the etching potion, forming an ellipse of a copper-free area.

At the same time, the line has large burrs, which greatly affects the transmission quality of the radio frequency signal, making the assembly equipment debugging NG; 2. Using laser engraving copper technology to process, using laser to remove the copper layer in the non-line area, can effectively maintain the graphics accuracy and ensure the right angle of the pad , The requirement of small burrs on the line, but the cost of laser engraving copper equipment is high and the efficiency is low. It takes 2 hours to engrave copper on a copper clad laminate with a size of 450mm×600mm, which cannot be used in mass production for the time being. It is only suitable for small sample production. Long delivery time; 3. The boards selected for the processing of RF radar printed circuit boards are thin (100-150um) and soft, and pits and plated folded plates are prone to appear during the processing. During electroplating, electroplating frames will be used to fix them and assist copper plating

However, due to the gap between the electroplating frame and the PCB, it is easy to hide the potion, which makes it impossible to dry effectively. The seepage of the potion leads to serious oxidation of the board surface. Discoloration problem occurs, resulting in scrap

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