Electronic component mounting line and electronic component mounting method
A technology of electronic parts and installation method, which is applied in the field of electronic parts installation line and electronic parts installation, can solve the problems of insufficient joint strength and insufficient strength impact of joints, and achieve the effect of suppressing poor joints
Active Publication Date: 2013-10-02
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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- Application Information
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Problems solved by technology
[0004] In the case of mounting CSP on a printed circuit board, when thermal stress or external force due to thermal cycles is applied, the joint strength of the joint part may be insufficient with only the joint force of soldering.
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[0035] First, the first electronic component, the second electronic component, and the substrate constituting the mounted substrate manufactured by the electronic component mounting line of the present invention will be described.
[0036] figure 1 It is a perspective view of an example of the first electronic component 200 . The first electronic component 200 has at least one connection terminal 201 joined by cream solder. Examples of electronic components bonded by cream solder include, for example, chip components typified by 0402 size and 1005 size, and leaded components such as transistors. Also, even for parts with bumps, parts that are joined with cream solder and do not need to be reinforced with resin for reinforcement or to apply (transfer) flux on solder bumps are also classified as 1st electronic parts.
[0037] Figure 2A It is a vertical sectional view of an example of the second electronic component 210, Figure 2B Its bottom view. The second electronic c...
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This electronic component mounting line is for sequentially performing cream solder printing on a substrate, mounting of electronic components, and reflow soldering while moving the substrate from upstream to downstream, and is equipped with: a substrate feeding device for feeding a substrate on which first and second electronic components are mounted; a printing device for applying cream solder to a first mounting region of the substrate; a first electronic component mounting device for mounting the first electronic component in the first mounting region where the cream solder has been applied; a second electronic component mounting device for applying a thermosetting resin to a reinforcement position which is set on the periphery of a second mounting region of the substrate, and for mounting the second electronic component, which has multiple bumps, in the second mounting region; and a reflow soldering device that heats the substrate, on which the first and second electronic components are mounted, and then cools the substrate in order to join the first and second electronic components to the substrate. After the thermosetting resin is applied to the substrate, the second electronic component mounting device mounts the second electronic component in such a manner that the periphery of the second electronic component comes in contact with the thermosetting resin.
Description
technical field [0001] The present invention relates to an electronic component mounting line and an electronic component mounting method for mounting small electronic components such as chip components and electronic components such as chip scale packages on a substrate. Background technique [0002] Electronic components such as integrated circuits, resistors, and capacitors are mounted on printed circuit boards. With the miniaturization of electronic equipment in recent years, the number and types of electronic components mounted on one printed circuit board have increased. Due to the miniaturization of electronic components, chip scale packages (CSP) are often mounted on substrates. [0003] The CSP has a main surface on which a plurality of terminals are regularly arranged, and solder bumps are formed on each terminal. To mount a CSP on a printed circuit board, solder bumps provided on multiple terminals are placed on an electrode of the printed circuit board called "...
Claims
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IPC IPC(8): H05K13/00H05K13/04
CPCB23K1/0008B23K1/008B23K1/203B23K3/0669B23K2101/42H01L2924/351H05K3/305H05K3/3436H05K3/3442H05K13/0465H05K13/0469H05K2203/0126Y10T29/49169Y02P70/50H01L2924/00H05K13/00H05K13/04H01L24/81
Inventor 前田宪圆尾弘树佐伯翼
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD