Electronic component mounting line and electronic component mounting method

Abstract

An electronic component mounting line, which sequentially performs paste solder printing, electronic component mounting, and reflow soldering on a substrate while moving the substrate from upstream to downstream, is characterized in that it includes: A substrate supply device for substrates of 1 and 2 electronic components; a printing device for applying cream solder to a first mounting area of ​​a substrate; and mounting a first electronic component on a first mounting area coated with cream solder The first electronic component mounting device; the second electronic component mounting device, which applies a thermosetting resin to the reinforcing position set on the peripheral part of the second mounting area of ​​the substrate, and has a plurality of solder bumps The second electronic component is mounted in the second mounting area; the reflow soldering device heats the substrate on which the first and second electronic components are mounted, leaves it to cool, and thereby joins the first and second electronic components to the substrate After the second electronic component mounting device applies the thermosetting resin to the substrate, it mounts the second electronic component such that the peripheral portion of the second electronic component is in contact with the thermosetting resin.

Description

technical field [0001] The present invention relates to an electronic component mounting line and an electronic component mounting method for mounting small electronic components such as chip components and electronic components such as chip scale packages on a substrate. Background technique [0002] Electronic components such as integrated circuits, resistors, and capacitors are mounted on printed circuit boards. With the miniaturization of electronic equipment in recent years, the number and types of electronic components mounted on one printed circuit board have increased. Due to the miniaturization of electronic components, chip scale packages (CSP) are often mounted on substrates. [0003] The CSP has a main surface on which a plurality of terminals are regularly arranged, and solder bumps are formed on each terminal. To mount a CSP on a printed circuit board, solder bumps provided on multiple terminals are placed on an electrode of the printed circuit board called "...

AI Technical Summary

Problems solved by technology

[0004] In the case of mounting CSP on a printed circuit board, when thermal stress or external force due to thermal cycles is applied, the joint strength of the joint part may be insufficient with only the joint force of soldering.

Moreover, the strength of the connection formed by soldering alone is not enough for the impact of dropping

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