Unlock instant, AI-driven research and patent intelligence for your innovation.

Semiconductor light-emitting device and board mounted with semiconductor light emitting device

A technology of light-emitting elements and element substrates, which is applied in the direction of semiconductor devices, electrical components, and electric solid-state devices, etc., can solve problems such as uncertainty, and achieve the effects of improving reliability, improving uniformity, and suppressing poor bonding

Inactive Publication Date: 2009-12-16
EVERLIGHT ELECTRONICS
View PDF9 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] On the other hand, in the case of increased bumps accompanying such an increase in the size of the LED chip, how to provide each bump has not been well established in the past.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Semiconductor light-emitting device and board mounted with semiconductor light emitting device
  • Semiconductor light-emitting device and board mounted with semiconductor light emitting device
  • Semiconductor light-emitting device and board mounted with semiconductor light emitting device

Examples

Experimental program
Comparison scheme
Effect test

no. 2 Embodiment approach

[0096] Next, use Figure 7 The schematic bottom view of the LED chip 1c shown in , describes the LED chip 1c as an example of the semiconductor light emitting element according to the second embodiment of the present invention. Such as Figure 7 As shown, in the LED chip 1c, two bump forming portions 133 are provided in the n electrode layer 131, and n bumps 141a and 141b are formed in the two bump forming portions 133, respectively. That is, in the LED chip 1 of the first embodiment described above, only one n-protrusion 141 is provided, but in the LED chip 1c of the second embodiment, one more n-protrusion is provided. In addition, other constitutions in the LED chip 1c are the same as figure 1 as well as figure 2 The LED chip 1 of the above-mentioned first embodiment shown in the figure is the same, and in the following description, the same components are given the same reference numerals, and the description thereof will be omitted.

[0097] Such as Figure 7 As sh...

no. 3 Embodiment approach

[0104] Next, use Figure 8 and Figure 9 , the LED chip 51 as an example of the semiconductor light emitting element according to the third embodiment of the present invention will be described. in addition, Figure 9 is a schematic partial bottom view of the LED chip 51, Figure 8 for Figure 9 A schematic partial cross-sectional view of the C-C line in the chip 51.

[0105] Such as Figure 8 with Figure 9 As shown, the LED chip 51 of the third embodiment differs from the LED chip 1 of the first embodiment in that the p-electrode layer ( corner side p-electrode layer), and the p-electrode layer (adjacent-side p-electrode layer) on which the p-protrusions p142b adjacent to the p-protrusion 142a of the corner P1 are formed are connected to each other as a common integral p electrode layer 132A. In addition, since other configurations are the same as those of the LED chip 1 of the first embodiment, the same reference numerals are assigned to the same components, and des...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

In a semiconductor light emitting device having a matrix of a plurality of bumps composed of one n-bump formed on an n-electrode layer and of a large number of p-bumps formed on p-electrode layers, the occurrence of a faulty junction after mounting can be suppressed by placement of the n-bump at center of the bump array, because the position at the center is most resistant to occurrence of stress after the mounting. Employment of such a configuration of bump array increases reliability of mounting thereof while improving uniformity of light emission intensity in the semiconductor light emitting device having an increased size.

Description

technical field [0001] The invention relates to a semiconductor light-emitting element flip-chip mounted on a circuit substrate and a circuit substrate on which the semiconductor light-emitting element is installed. Background technique [0002] In recent years, a technique of mounting a plurality of bare chips of semiconductor light-emitting elements represented by light-emitting diodes (hereinafter referred to as "LEDs") on a circuit board to manufacture lighting and display devices, etc. has been used. As bare chips of LEDs (hereinafter referred to as "LED chips"), for example, chips having a size of 0.3 mm square are used, and are mounted at a high density in a predetermined area on a substrate. [0003] Here, use Figure 11A and Figure 11B The main structure of such a conventional LED chip is demonstrated with the drawing shown in . in addition, Figure 11B is a schematic bottom view of the LED chip 501, Figure 11A show Figure 11B Schematic configuration of the c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/08H01L33/38H01L33/62
CPCH01L33/38H01L33/08H01L2924/01004H01L2924/01079H01L24/17H01L33/62H01L2224/16H01L24/05H01L24/06H01L24/14H01L2224/05166H01L2224/05552H01L2224/05568H01L2224/05573H01L2224/0558H01L2224/05644H01L2224/13014H01L2924/12041H01L2924/00H01L2924/00014H01L2924/00012
Inventor 东和司石谷伸治
Owner EVERLIGHT ELECTRONICS