Thinning control method and system for backside of tsv wafer based on eddy current technology
A backside thinning and wafer technology, applied in the field of microelectronics, can solve the inability to accurately obtain the distance between the bottom of the conductive metal pillar and the back of the wafer, the depth of the hole, the depth error of the deposition of the conductive metal pillar, etc. Influence and other problems, to achieve the effect of convenient installation, small measurement error and low process cost
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0032] The present invention will be described in detail below in conjunction with specific embodiments shown in the accompanying drawings. However, these embodiments do not limit the present invention, and any structural, method, or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present invention.
[0033] Such as figure 1 As shown, the TSV wafer backside thinning control method based on eddy current technology in a preferred embodiment of the present invention comprises the following steps:
[0034] S1. Fix the eddy current sensor on the transmission shaft of the wafer thinning device, so that the eddy current sensor is perpendicular to the wafer surface and can move up and down with the transmission shaft;
[0035] S2. Apply alternating current to the eddy current sensor, use a thinning device to thin a specific TSV wafer, and formulate a calibration curve between the induction signal and dista...
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com