Light emitting diode encapsulating structure and manufacturing method thereof
A technology for light-emitting diodes and packaging structures, applied in electrical components, electric solid-state devices, circuits, etc., can solve the problems of large workload, unfavorable mass production, complex overall structure, etc. Effect
Inactive Publication Date: 2013-10-30
深圳市方腾光源技术有限公司
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Problems solved by technology
However, in the above two methods, the former needs to change the installation position of the light-emitting diode chip, so that the circuit connection and spatial position arrangement inside the lighting device need to be redesigned, and the latter needs to be achieved by adding an additional reflective structure. It is necessary to adjust the internal structure of the lighting device, which makes the overall structure complex, the workload is large, and it is not conducive to mass production
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[0023] See figure 1 The light emitting diode packaging structure 100 provided by the embodiment of the present invention includes a substrate 10, two electrodes 20 arranged at intervals on the substrate 10, a light emitting diode chip 30 fixed on the first substrate 10 and electrically connected to the electrodes 20, located at The reflective cup 40 on the side of the LED chip 30 , the packaging layer 50 covering the LED chip 30 and a reflective layer 60 .
[0024] The substrate 10 is roughly in the shape of a rectangular plate, which includes four sides, a first side 11, a second side 12, a third side 13 and a fourth side 14, wherein the first side 11 and the third side The side 13 is opposite, and the second side 12 is opposite to the fourth side 14 .
[0025] The reflective cup 40 is formed on the substrate 10 along the first side 11, the second side 12 and the third side 13 of the substrate 10, thereby forming an opening 41 at the fourth side of the substrate 10 for Ligh...
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A side-view LED package includes a substrate, a pair of electrodes connected to the substrate, an LED die electrically connected to the electrodes, a reflective cup formed on the substrate, an opening defined at a lateral side of the reflective cup, an encapsulation formed on the substrate to cover the LED die, and a reflective layer coated on a top of the encapsulation and a top of the reflective cup, wherein part of light emitting from the LED die is reflected by the reflective cup and the reflective layer and then emits out of the side-view LED package from the opening. The present disclosure also provides a method for manufacturing the side-view LED package described above.
Description
technical field [0001] The invention relates to a semiconductor packaging structure and a manufacturing method thereof, in particular to a light emitting diode packaging structure and a manufacturing method thereof. Background technique [0002] Compared with traditional light sources, Light Emitting Diodes (LEDs) have the advantages of light weight, small size, low pollution, and long life. As a new type of light source, they have been more and more widely used. [0003] Existing lighting devices or display devices have more and more demands for side light sources. However, the existing side light sources usually adopt the original structure of the LED chip installed on the side of the device body to laterally emit light. the emitted light, or by adding a reflective structure within the range of the emitted light from the LED chip, so as to obtain laterally emitted light. However, in the above two methods, the former needs to change the installation position of the light-e...
Claims
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IPC IPC(8): H01L33/60H01L33/48H01L33/00
CPCH01L33/60H01L33/46H01L2933/0058H01L24/97H01L2224/48091H01L2224/48247H01L2924/12041H01L2924/00014H01L2924/00
Inventor 陈隆欣罗杏芬曾文良
Owner 深圳市方腾光源技术有限公司