Exposure apparatus, exposure method, device manufacturing method, and aperture plate
A technology of exposure device and exposure method, which can be used in photolithography process exposure device, semiconductor/solid-state device manufacturing, microlithography exposure equipment, etc., and can solve problems such as uneven mask pattern
Active Publication Date: 2016-03-23
CANON KK
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However, as described above, for example, if the width of the superimposed region of the projection region PRa and the projection region PRb, that is, the shape of the end portion of each projection region in the Y-axis direction is not controlled, the pattern of the mask will cause uneven
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[0025] Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, the same reference numerals are assigned to the same components, and overlapping descriptions will be omitted.
[0026] figure 1 It is a schematic diagram showing the structure of the exposure apparatus 1 which is one aspect of the present invention. The exposure apparatus 1 overlaps a part of the projection area formed on the substrate via the projection optical system in the first direction (X-axis direction), and aligns the mask and the substrate in the second direction (Y-axis direction) perpendicular to the first direction. Direction) move synchronously to transfer the pattern of the mask to the substrate. In other words, the exposure apparatus 1 is a scanning type exposure apparatus that performs continuous exposure.
[0027] In order to realize link exposure, the following two methods can be considered. The first method i...
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The invention provides an exposure device. The exposure device has a projection optical system for projecting a pattern of a mask to a base plate, and enables a part of a projection region formed on the base plate to be overlapped in a first direction while enabling the mask and the base plate to move simultaneously in a second direction perpendicular to the first direction so as to transfer the pattern to the base plate. The exposure device is characterized by having an opening plate for regulating an opening of the above mentioned projection region, an adjusting part for shielding a part of the above mentioned opening and adjusting the shape of an end of the above mentioned projection region in the first direction, an obtaining part for obtaining the width of an overlapped region of the above mentioned projection region in the first direction, and a control part for determining the shape of the end of the above mentioned projection region in the first direction based on the obtained width to reduce unevenness of illumination distribution on the base plate and controlling the adjusting part to enable the end of the above mentioned projection region in the first direction to be in a determined shape.
Description
technical field [0001] The present invention relates to an exposure device, an exposure method, a device manufacturing method and an opening plate. Background technique [0002] When manufacturing liquid crystal display devices and the like using photolithography, an exposure device is used that projects a pattern formed on a mask (original plate) onto a substrate via a projection optical system and transfers the pattern. In recent years, exposure apparatuses have been required to expand the area (exposure region) that can be exposed by scanning exposure in order to cope with the increase in size and cost of liquid crystal display devices. [0003] As a technique for enlarging an exposure area, for example, Japanese Patent Application Laid-Open No. 2009-237916 proposes so-called concatenated exposure using a plurality of projection optical systems. Concatenated exposure seeks to expand exposure as a whole by arranging the projection areas formed by each of the plurality of ...
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IPC IPC(8): G03F7/20
CPCG03F1/66G03F7/2006G03F7/22H01L21/0274
Inventor 宫崎恭一长野浩平
Owner CANON KK