Semiconductor Packaging and Testing Fine-Day Feeding Control Method Based on Constrained Minimum Spanning Tree
A technology of packaging testing and control methods, applied in the field of control, can solve problems such as low equipment utilization, machine modification, and long production cycle, and achieve the effects of increasing production rate, shortening production cycle, and reducing the time cost of machine modification
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[0032] The present invention will be further described below with reference to the specific drawings and embodiments.
[0033] like figure 1 Shown: A constrained minimum spanning tree-based semiconductor packaging and testing fine-tuning control method, including the following steps:
[0034] Step 1: Obtain the type and quantity n of the products to be fed on a certain day from the current daily rough feeding control table, and initialize it as the set of all products to be processed in the daily fine feeding plan; and obtain from the current daily rough feeding control table. Production quantity C of each product i ;
[0035] Step 2: For the product set in Step 1, obtain the cost of changing the machine between the n products;
[0036] Step 3: For n products in the product set, n vertices of a graph are formed, and the cost of modification between any two products constitutes The weights of the edges; in this way, a completely undirected connected graph G=(V, E) is obtai...
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