Semiconductor encapsulation testing fine feeding control method based on constrained minimum spanning tree
A technology of packaging, testing and control methods, applied in the field of control, can solve the problems of low equipment utilization, long production cycle, and machine modification, and achieve the effects of improving production rate, shortening production cycle, and reducing the cost of machine modification time.
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[0032] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0033] Such as figure 1 Shown: a semiconductor packaging test fine daily feeding control method based on a constrained minimum spanning tree, including the following steps:
[0034] Step 1: Obtain the number n of products to be fed on a certain day from the current daily rough feeding control table, and initialize it as the set of all products to be processed in the daily fine feeding plan; and obtain it from the current daily rough feeding control table The production quantity C of each product i ;
[0035] Step 2: For the product set in step 1, get the modification cost between these n products;
[0036] Step 3: For n products in the product set, n vertices of a graph are formed, and the modification cost between any two products constitutes In this way, a completely undirected connected graph G=(V, E) is obtained. The vertex set V of the graph is the se...
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