Phase change soaking plate

Abstract

The invention provides a phase change soaking plate which comprises two layers of welded metal plates, wherein a copper mesh and a metal mesh plate are welded between the two layers of metal plates, and a first welding spot and a second welding spot are arranged between the metal mesh plate and the metal plates. The copper mesh is provided with a spiral multilayer structure. The metal plates are copper plates or aluminum plates. The edge of the outer layer metal plate in the two layers of metal plates is provided with an inward bent structure, the edge of the inner layer metal plate is provided with a Z-shaped structure, and the Z-shaped structure of the inner layer metal plate is embedded into the inward bent structure of the outer layer metal plate. The phase change soaking plate has the advantages that the mesh-shaped copper plate and the spiral copper mesh are welded between the two layers of metal copper plates or aluminum plates, meanwhile a double-welding technique is adopted between the metal copper plates on two sides, therefore air leakage of a soaking material is avoided, the heat conduction coefficient of the soaking material is effectively improved, the heat conduction coefficient of the soaking material reaches 3500-5000w / mK, and the thickness is smaller than or equal to 0.5mm.

Description

technical field [0001] The invention relates to a metal heat-conducting material, in particular to a phase-change soaking plate. Background technique [0002] Electronic products are ultra-thin, and ordinary heat pipes and vapor chambers can no longer meet the thickness requirements of products. Currently, the thickness of the commonly used vapor chambers is relatively thick, usually greater than 0.5mm, and the thermal conductivity is low, which affects the rapid transfer of heat. Therefore, , this type of vapor chamber can no longer meet the needs of the rapid development of ultra-thin and high-power electronic products. Therefore, how to make a new vapor chamber to reduce the thickness of the vapor chamber and improve the thermal conductivity of the vapor chamber has become an important problem to be solved urgently in the development of the electronics industry. SUMMARY OF THE INVENTION [0003] In order to solve the problem that the thickness of the existing soaking m...

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problem of thicker thickness and relatively low thermal conductivity of the existing heat equalizing material, the present invention provides the following technical solutions:

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