Damp-proof shaving board low in absorbent thickness expansion rate and manufacturing method thereof

A production method and technology of particleboard, applied to other home appliances, pretreatment of molding materials, household components, etc., can solve the problems of furniture performance and aesthetic decline, shortened service life, etc., and achieve low water absorption thickness expansion rate and long service life long effect

Inactive Publication Date: 2013-12-04
大亚木业(福建)有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the particleboard continuously absorbs moisture in the air and contacts with water during use, which will inevitably cause deterioration in the performance and appearance of the furniture, as well as a serious shortening of the service life.

Method used

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  • Damp-proof shaving board low in absorbent thickness expansion rate and manufacturing method thereof
  • Damp-proof shaving board low in absorbent thickness expansion rate and manufacturing method thereof
  • Damp-proof shaving board low in absorbent thickness expansion rate and manufacturing method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] First, the shavings are prepared by conventional manufacturing processes, and then the glue is adjusted, which is divided into surface layer raw materials and core layer raw materials for glue adjustment respectively. The mass percentage is 1.4-1.60%, and the moisture content of the surface layer is controlled: 9-14%. According to the actual moisture content, an appropriate amount of water is added and stirred, and the content of the surface layer of shavings is calculated according to the density of the finished board to be manufactured; Including core layer shavings, glue mass percentage 8-10%, curing agent mass percentage 1.3-2%, paraffin mass percentage 0.7-1.00%, control the moisture content of the core layer: 4-8%, after adding appropriate amount of water according to the actual moisture content Stir, wherein the glue is preferably E0 or E1 grade particleboard synthetic resin adhesive, and the content of the core layer shavings is calculated according to the densit...

Embodiment 2

[0046]First, the shavings are prepared by a conventional manufacturing process, and then the glue is adjusted, which is divided into surface layer raw materials and core layer raw materials to adjust the glue respectively. The mass percentage is 1.4-1.7%, and the moisture content of the surface layer is controlled: 9-14%, depending on the actual moisture content, adding an appropriate amount of water and then stirring, wherein the content of the surface layer of shavings is calculated according to the density of the finished board to be manufactured; the core layer Raw materials include core layer shavings, glue mass percentage 9.2-9.6%, curing agent mass percentage 1.4-1.8%, paraffin mass percentage 0.7-1.1%, control the moisture content of the core layer: 4-8%, add appropriate amount of water depending on the actual moisture content Finally, stir, wherein the glue is preferably E0 or E1 grade particleboard synthetic resin adhesive, and the content of the core layer shavings i...

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Abstract

The invention discloses a damp-proof shaving board low in absorbent thickness expansion rate and a manufacturing method thereof. The manufacturing method comprises the specific steps of wood shaving preparation, glue mixing, hot pressing, cooling and product forming. In the step of glue mixing, glue mixing is respectively conducted on surface layer materials and core layer materials, the surface layer materials comprise wood shavings, 10-13% of glue, 0.5-1% of curing agents and 3-4 kg/m<3> of water-proofing agents, and the wood shavings, the 10-13% of glue, the 0.5-1% of curing agents and the 3-4 kg/m<3> of water-proofing agent are mixed after a moderate amount of water is added; the core layer materials comprise wood shavings, 8-10% of glue, 1.3-2% of curing agents and 2-3 kg/m<3> of water-proofing agents, and the wood shavings, the 8-10% of glue, the 1.3-2% of curing agents and the 2-3 kg/m<3> of water-proofing agents are mixed after a moderate amount of water is added. In the hot pressing step, the hot pressing speed is 270-450mm/s, and a partition hot pressing mode is adopted. The damp-proof shaving board low in absorbent thickness expansion rate is suitable for being used in the damp environment, produces no deformation, and is long in service life.

Description

technical field [0001] The invention relates to the field of wood-based panel manufacturing in the wood industry, in particular to a moisture-proof particleboard with a low water-absorbing thickness expansion rate and a production method thereof that can meet the requirements for use under high-humidity conditions. Background technique [0002] The conventional particleboard manufacturing process is to process wood or various residues in wood production into shavings, add a certain amount of adhesive, and make finished products after stirring, paving and molding, hot pressing and other processes. Since the main component of particleboard is wood raw material, under humid conditions, the board will be deformed due to the absorption of water by the board, which will eventually lead to deformation and damage of wood products. [0003] Water absorption thickness expansion rate is one of the important indicators of particleboard. The 2-hour water absorption thickness expansion ra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N3/02B27N1/02B27N3/10
Inventor 吴方境林洪治
Owner 大亚木业(福建)有限公司
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