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Winding-type solid electrolytic capacitor packaging structure

A technology of solid electrolysis and packaging structure, applied in the direction of electrolytic capacitors, capacitor shells/packages, capacitors, etc., can solve problems such as the design of conductive pins of wound solid electrolytic capacitors and the limitation of electrical connection methods.

Active Publication Date: 2013-12-04
钰邦电子(无锡)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The embodiment of the present invention is to provide a winding type solid electrolytic capacitor packaging structure, which can solve the problem that the existing "winding type solid electrolytic capacitor does not have any packaging, so that the design of the winding type solid electrolytic capacitor in the conductive pin Restricted on the way of electrical connection"

Method used

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  • Winding-type solid electrolytic capacitor packaging structure
  • Winding-type solid electrolytic capacitor packaging structure
  • Winding-type solid electrolytic capacitor packaging structure

Examples

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no. 1 example 〕

[0068] see Figure 1A to Figure 1C As shown, the first embodiment of the present invention provides a wound-type solid electrolytic capacitor packaging structure, which includes: a capacitor unit 1 , a packaging unit 2 and a conductive unit 3 .

[0069] First, if Figure 1A As shown, the capacitor unit 1 includes at least one wound capacitor 10 , wherein the wound capacitor 10 has at least one first conductive pin 101 and at least one second conductive pin 102 . Furthermore, the wound capacitor 10 includes a capacitor core 10A wound together by at least one positive foil 100A, at least one negative foil 101A and at least one separator 102A, and a wrapping capacitor core 10A. The casing 10B (the casing 10B includes an outer cover), and the insulating paper 102A is adsorbed with conductive polymers and stacked between the positive foil 100A and the negative foil 101A.

[0070] Furthermore, if Figure 1BAs shown, the package unit 2 includes a package body 20 covering the capaci...

no. 2 example

[0076] see figure 2 As shown, the second embodiment of the present invention provides a wound-type solid electrolytic capacitor packaging structure, which includes: a capacitor unit 1 , a packaging unit 2 and a conductive unit 3 . Depend on figure 2 and Figure 1B It can be seen from the comparison that the biggest difference between the second embodiment of the present invention and the first embodiment is: in the second embodiment, when the wound capacitor 10 is vertically placed in the package body 20, the wound capacitor 10 The right side end and the left side end will respectively have a first flat surface 1001 and a second flat surface 1002 due to being flattened, and the bottom end and the top end of the wound capacitor 10 have a first side surface 1003 and a first side surface 1003 respectively. a second side surface 1004 . Therefore, the L-shaped contact section 310A of the first embedded portion 31A can contact the second flat surface 1002 and the first side sur...

no. 3 example

[0078] see image 3 As shown, the third embodiment of the present invention provides a wound-type solid electrolytic capacitor packaging structure, which includes: a capacitor unit 1 , a packaging unit 2 and a conductive unit 3 . Depend on image 3 and figure 2 The comparison shows that the biggest difference between the third embodiment of the present invention and the second embodiment is: in the third embodiment, both the first conductive pin 101 and the second conductive pin 102 can be connected from the first conductive pin 10 of the wound capacitor 10 The two side surfaces 1004 extend out to contact the first conductive terminal 31 and the second conductive terminal 32 respectively.

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Abstract

The invention relates to a winding-type solid electrolytic capacitor packaging structure, comprising a capacitor unit, a packaging unit and a conductive unit. The capacitor unit comprises a winding-type capacitor which is provided with a first conductive lead pin and a second conductive lead pin. The packaging unit comprises a packaging body coating the capacitor unit. The conductive unit comprises a first conductive terminal electrically connected with the first conductive lead pin and a second conductive terminal electrically connected with the second conductive lead pin. The first conductive terminal and the second conductive terminal are separated from each other. The first conductive terminal is provided with a first embedded part which is contacted with the first conductive lead pin and is coated in the packaging body and a first naked part which is connected with the first embedded part and is exposed out of the packaging body; and the second conductive terminal is provided with a second embedded part which is contacted with the second conductive lead pin and is coated in the packaging body and a second naked part which is connected with the second embedded part and is exposed out of the packaging body.

Description

Technical field [0001] The present invention is related to a packaging structure, especially a packaging structure of a wound solid electrolytic capacitor. Background technique [0002] Wind -type solid -state electrolytic capacitors include: capacitors components, containment components and seal components.Capacitor components are scratched around the anode foil connected to the anode and the cathode foil connected to the cathode, and an electrolyte layer is formed between the anode foil and the cathode foil.The containment component has the opening and the capacitor component.The sealing component has an open porting of an anode and the penetration of the cathode penetration and the opening of a sealing containment component.In addition, there is a predetermined interval between the aforementioned sealing components and the aforementioned electrical container components, and at least one of the anodes and cathodes has at least one of the stop components used to ensure the gap.H...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G9/08H01G9/012
Inventor 林清封邱继皓张坤煌
Owner 钰邦电子(无锡)有限公司
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