LED package, led display and method for manufacturing led package
A technology of LED display and LED packaging, which is applied in the direction of instruments, identification devices, semiconductor devices, etc., and can solve problems such as difficult to read text
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[0040] The present invention is directed to LED packages and LED displays employing them, wherein the LED packages contain different arrangements to increase the emission contrast between adjacent LED packages in the display and to reduce reflections caused by light outside the packages. These packages may include one or more LED chips mounted on a submount or in a package housing and conversion material. A portion of the exterior surface of the submount or housing may comprise a color that contrasts with the color of light emitted from the LED package. Part of the exterior surface of the submount may also include a matte surface to reduce reflections.
[0041] In some embodiments, the area of the submount or housing immediately surrounding the LED chip may comprise a material that is substantially the same color as or reflects light from the LED chip. Such a reflective area may at least partially comprise a reflective cup. Areas of the submount outside such reflective are...
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