Supercharge Your Innovation With Domain-Expert AI Agents!

Multi-chip module, system and method for communication

A multi-chip and module technology, applied in transmission systems, digital transmission systems, semiconductor/solid-state device components, etc., can solve the problems of increased cost, complexity and/or high cost of semiconductor manufacturing process

Active Publication Date: 2017-03-01
XILINX INC
View PDF3 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the complexity and / or cost associated with the semiconductor manufacturing process of making these integrated circuits for various application environments is quite high
Furthermore, if a protocol is changed sufficiently, these large monolithic ICs may need to be replaced, increasing costs

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-chip module, system and method for communication
  • Multi-chip module, system and method for communication
  • Multi-chip module, system and method for communication

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027]In the following description, numerous specific details are set forth in order to provide a more thorough description of specific embodiments of the invention. However, it will be understood by those skilled in the art that the present invention may be practiced without all of these specific details presented below. In other instances, well-known features have not been described in detail in order not to obscure the invention. For ease of illustration, the same numerical designations are used in different drawings to refer to the same items; however, in alternative embodiments, the items may be different. Also, for clarity, a single instance of an object may be used to indicate multiple instances thereof.

[0028] A programmable logic device (PLD) is a well-known type of integrated circuit that can be programmed to perform specified logic functions. One type of programmable logic device, a field programmable gate array (FPGA), typically includes an array of programmabl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

An embodiment of a multi-chip module (500) is disclosed. In this embodiment of the multi-chip module (500), a transceiver chip (501) has a plurality of transceivers (511). A crossbar switch die (503) has at least one crossbar switch (513). A protocol logic block chip (502) has a plurality of protocol logic blocks (512). The transceiver die (501), the crossbar switch die (503) and the protocol logic block die (502) are coupled together to an interposer (510). The interposer (510) interconnects the transceivers (511) and the protocol logic blocks (512) to each other, and interconnects the protocol logic blocks (512) and the at least one crossbar switch (513 ) are interconnected with each other.

Description

technical field [0001] One embodiment of the present invention relates to integrated circuit devices (ICs). More particularly, one embodiment of the present invention relates to multi-chip modules for communication. Background technique [0002] High throughput switch fabric integrated circuits are traditionally formed as a single monolithic integrated circuit, which tends to be a substantially large integrated circuit. Therefore, the complexity and / or cost of the semiconductor manufacturing process associated with making these integrated circuits for various application environments is quite high. Furthermore, if a protocol is changed sufficiently, these large monolithic integrated circuits may need to be replaced, increasing costs. Accordingly, it would be desirable to provide a high throughput switch fabric to reduce one of these costs. Contents of the invention [0003] One or more embodiments generally relate to multi-chip modules for communication. [0004] One em...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H04L12/933H01L25/18
CPCH01L23/147H01L25/18H04L49/101H04L49/109H04L49/405H01L25/0655H01L2224/16225H01L2924/15192H01L2924/157H01L23/14H01L25/065
Inventor 艾弗伦·C·吴
Owner XILINX INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com