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Transfer mold body

A molding and transfer technology, which is applied in the directions of printing, printing devices, synthetic resin layered products, etc., can solve the problem that the transfer layer cannot be transferred to the step part well.

Inactive Publication Date: 2013-12-25
KK TOKAI RIKA DENKI SEISAKUSHO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, as the present invention Figure 7 As shown, in the case where the level difference portion 102 is formed on the outer peripheral portion of the transfer target body 100, there is a possibility that the transfer layer cannot be well transferred to the surface of the level difference portion.

Method used

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Embodiment Construction

[0028] First, the transfer molded body 10 according to the embodiment of the present invention will be described, and then the transfer device 30 for producing the transfer molded body 10 will be described.

[0029] (About transfer molding 10)

[0030] figure 1 A part of the transfer molded body 10 is shown in a perspective view in . and, figure 2 (A) shows the whole transfer molded body 10 in plan view, figure 2 (B) shows a part of the transfer molded body 10 in an enlarged cross-sectional view.

[0031] The transfer molded body 10 is, for example, a component applied to an interior component of a vehicle (a decorative panel to be incorporated into a dashboard or the like).

[0032] As shown in the above-mentioned figures, the transfer molded body 10 is configured to include a base material 12 and a transfer layer 28 . Furthermore, the base material 12 is made of resin, and has a main body portion 14 and a step portion 16 .

[0033] The main body portion 14 is formed...

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Abstract

The invention provides a transfer mold body. A transfer layer is transferred well to a step portion. In the transfer mold body (10), a projection and indentation portion (22) is formed to a front face of a bottom wall (22) of a step portion (16). When covering a transfer film (24) over a base member (12), air between the transfer film and the step portion (16) is accordingly expelled from between indented portions of the projection and indentation portion (22) and the transfer film (24) at an edge portion of the bottom wall. The transfer film (24) can accordingly be covered over the step portion (16) whilst suppressing air from remaining between the transfer film(24) and the step portion(16). A transfer layer of the transfer film can accordingly is transferred well to the front face of the step portion (16).

Description

technical field [0001] The present invention relates to a transfer molded article provided with a transfer layer. Background technique [0002] Patent Document 1 below discloses a transfer method for transferring a transfer layer to a body to be transferred (transfer molded body). Specifically, a transfer material having a transfer layer and a base film (base film) is placed opposite to the body to be transferred, and after the transfer material is heated and pressurized, the base film is peeled off from the transfer layer, Thereby, the transfer layer is transferred to the to-be-transferred body. [0003] Patent Document 1: Japanese Patent Application Laid-Open No. 06-15945 [0004] However, as the present invention Figure 7 As shown, when the level difference portion 102 is formed on the outer peripheral portion of the transfer target body 100 , there is a possibility that the transfer layer cannot be well transferred to the surface of the level difference portion. That...

Claims

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Application Information

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IPC IPC(8): B32B27/06B41M1/40B60R13/00
CPCB32B7/06B32B1/00B32B3/02B32B3/30B32B2419/00B32B2451/00B32B2605/003Y10T428/24264B32B3/06
Inventor 市川贵茂山田英二月原淳杉坂贤一定松隆辅今枝胜行小川惣一郎
Owner KK TOKAI RIKA DENKI SEISAKUSHO
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