LED (light emitting diode) lamp

Abstract

The invention discloses an LED (light emitting diode) lamp. The LED lamp comprises a lamp cap, an LED luminous body and a radiator, wherein the lamp cap is connected with an external power source; the LED luminous body is arranged on the lamp cap; the radiator is arranged on the periphery of the LED luminous body and comprises an annular body, a first heat conduction layer and a second heat conduction layer; the annular body serves as a structural support; the first heat conduction layer is arranged on the surface of the inner side of the body; the second heat conduction layer is arranged on the surface of the outer side of the body; and a plurality of through holes for strengthening heat convection radiation are also formed in the radiator along the radial direction. Compared with a common radiator made of metal materials such as aluminum and aluminum alloy, the radiator of the LED lamp has the characteristic that the first heat conduction layer and the second heat conduction layer in the LED lamp can be connected with each other by the through holes, so that heat convection can be realized, and radiation is facilitated. The type selection of the material of the body of the radiator is more flexible than that of the material of the body of the radiator made of a metal material at present, the radiator can be light and cheap, so that the price of the LED lamp is reduced, and quick popularization and quick development of LED illumination are facilitated.

Description

technical field [0001] The invention relates to the field of lighting, and more specifically, to an LED lamp. Background technique [0002] The heat conduction path is mainly divided into three forms, which are heat conduction transfer, heat convection transfer, and heat radiation transfer. The heat generated by the LED chip comes out of the metal heat sink of the LED chip, first passes through the solder to the aluminum substrate or copper substrate, and then passes through the thermal conductive adhesive to the heat sink. The usual way to improve heat dissipation is to optimize the heat sink. At present, the existing LED heat dissipation designs basically use aluminum or aluminum alloy heat sinks. The heat sinks often use fin shapes, such as figure 1 shown. The problems in this heat dissipation design are: [0003] (1) The copper heat sink has excellent heat conduction but is heavy, the aluminum body is slightly lighter but the heat conduction is relatively poor, and th...

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Problems solved by technology

[0003] (1) The copper heat sink has excellent heat conduction but is heavy, the aluminum body is slightly lighter but the heat conduction is relatively poor, and the price of metal materials and production costs are high, and the volume is heavy. If it is too thin and light, it cannot provide good structural support for LED lamps. The cost of radiators cannot be reduced, resulting in high overall cost of LED lamps, which is not conducive to the popularization and development of LED lamps

[0004] (2) Regardless of whether it is a copper radiator or an aluminum radiator, the traditional heat dissipation design only emphasizes heat conduction and ignores heat convection. When the heat convection is not smooth, the heat dissipation effect will be greatly reduced even if the heat conduction is good;

[0005] (3) The densely distributed fins seem to increase the heat dissipation area, but limit the air circulation between the fins. The real effective heat dissipation area is not only not increased, but may be reduced;

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